[SI-LIST] via-in-pad technology
- From: "Inchauspe, Greg E" <greg.e.inchauspe@xxxxxxxx>
- To: Sig Integ Group <si-list@xxxxxxxxxxxxx>
- Date: Thu, 06 May 2004 14:03:33 -0700
Hello SI group,
I'm considering using via-in-pad or via fill technology to mount a 1704 pin
BGA. Does anyone have any experience with using this technology for large
BGA's? I've heard that there are potential thermal problems that can cause the
via barrel to crack.
Thanks,
Greg
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