SI Journal hosts webinar on the laminate material characterization for highs
speed applications on May 17th at 12 PM Eastern/9 AM Pacific Time.
The webinar is mostly about how to get analysis to measurement correlation
for PCB interconnects up to 50 GHz and beyond. What should be dielectric and
conductor roughness models for such analysis and how to get the parameters
of the models? How usable data on the laminate spreadsheets? Is it possible
to transmit 100 Gbps over copper PCB traces? What should be done to push the
boundary to 200 Gbps? We will try to answer these and other relevant
questions. If you are interested, here is webinar description with the
registration link
https://www.signalintegrityjournal.com/events/26-laminate-materials-characte
rization-for-high-speed-applications
Best regards,
Yuriy
Yuriy Shlepnev, Ph.D.
President, Simberian Inc.
2629 Townsgate Rd., Suite #235, Westlake Village, CA 91361, USA
Office +1-702-876-2882; Fax +1-702-482-7903
Cell +1-206-409-2368; Virtual +1-408-627-7706
Skype: shlepnev
www.simberian.com
Simbeor - Accurate, Productive and Cost-Effective Electromagnetic Signal
Integrity Software
2010 and 2011 DesignVision Award Winner, 2015 Best In Design&Test Finalist
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