[SI-LIST] stupid VNA / TDR / TDT Measurement / Setup question
- From: hermann.ruckerbauer@xxxxxxxxxxxx
- To: si-list@xxxxxxxxxxxxx
- Date: Fri, 14 Nov 2003 09:57:16 +0100
Hello all,
I do have a stupid question, maybe you can enlighten me ....
Assuming a 6 layer board (Sig1 / GND / Sig2 / / Sig3 / Power / Sig4) with
some single ended ustrip and stripline transmissionlines teststructures on
all 4 signal layers. There are no passive components on the PCB (e. g. no C)
My probes do have a signal and a GND pin. All teststructures does have a
signal pad and a GND pad for contacting with the probe.
Therefor I'm fine with Sig1 and Sig2! both are nice GND referenced,
therefore I do not expect a problem with the measurements there!
But Signal 3 and 4 are Power referenced. And so far there is not too much AC
short between PWR and GND plane. The distance between this planes is > 30
mil, therefore I would expect the most AC short coming from the Vias. And
now I'm not really sure what happens, if I'm doing a VNA / TDR / TDT
measurement on Sig3 and Sig4, which are Power referenced, as my measurement
ground is connected to the GND plane on the board.....
Can the results tell me something, or can I forget the results completly ???
Is there a difference for VNA / TDR or TDT Measurments in this case ?
thanks
Hermann
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