Hi : I have a question that may be not part of the typical SI issue and all comments are welcomed. Stackup : Top -layer signal routing. Dielectric 60mil Bottom -layer ground plane with some limited routing Does the ground plane on the bottom layer of a 2-layer board still provide good return path ? Or should I just use the bottom layer for routing and try to pour copper on both top and bottom to provide return path instead. Assuming that traces are spacing 6-mil apart on the top layer and the dielectric thickness is 62-mil between the 2 layers. I imagine most of signals would seek the closest metal for return path and would not see the ground plane that is relatively far away (6mil vs 60mil). The particular design involves 166Mhz SDR memory and lots of mixed-signal analog function. Thanks for your help. __________________________________ Do you Yahoo!? Win a $20,000 Career Makeover at Yahoo! HotJobs http://hotjobs.sweepstakes.yahoo.com/careermakeover ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu