[SI-LIST]
- From: "Geping Liu" <GLIU@xxxxxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Thu, 10 Apr 2008 15:50:24 -0700
Hi All,
Please find a Package Design Automation Engineer opening at
Altera Corporation Packaging Group. Please directly contact John Xie or
Craig Myers for more detailed information.
Thanks,
Geping
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Job Title: MTS/Sr. MTS, Package Design Automation Engineer
Major Job Responsibilities
1. Package design automation and tool engineering. IC-PKG-PCB co-design
methodology engineering, process development and tool integration.
Interfacing with EDA tool vendor, internal package design team,
electrical engineering team, IC Design and IC Layout team to propose,
develop, debug, introduce and implement highly automated and integrated
advanced interconnection design tool and design process solutions to
substantially reduce package design feasibility engineering's cycle
time, human errors and resource requirement.
2. New package design engineering. Interfacing with Corporate new
product development engineering team (ICD, PE, software, technology,
etc) to define design rule and guidelines considering performance, cost
and reliability etc factors and design engineering schedule to meet the
corporate new generation product need.
Qualifications
MS/PhD in EECS/Physics/Material Sciences. At least 5 years experience
in high density IC packaging design engineering field. Must understand
the concept of IC-package co-design and has the ability to propose
package centric IC layout. Must be tool savvy, familiar with SKILL,
PERL etc software language and has the ability to work with EDA tool
vendors for advanced tool evaluation, introduction and integration.
Must understand circuitry signal integrity and impact to package design
consideration including pin assignment, design rules, layer count
optimization, etc. Must attend to every detail. Must have great
communication skills and project leadership skills and long term
dedication to the design engineering field.
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