Hi, Jim: If properly implemented in a multilayer board, 1/2-ounce copper planes are fine, particularly for high frequency designs. However, there are some caveats. Based on skin effect, the shielding (reduction in ground plane current from one side to the other) offered by 1/2-ounce copper is ~26 dB (three skin depths) at 120 MHz. Higher frequencies are better shielded, lower are not. As an EMI consideration, low inductance is the main concern/target for minimizing development of common mode noise; therefore, use efficient paralleling of the reference planes by applying a reasonable grid pattern of vias to interconnect the planes. This planning also has beneficial signal integrity effects. If you are delivering 30 or more amperes of Vcc current through the planes, the total board power dissipation (and heat extraction) can become a problem. Heavier copper planes help get the heat to the board edges and mounting points. In general, using 1/2-ounce copper aids etching accuracy, costs less, and tends to tighten controlled impedance tolerances. There are many more considerations, but that's my input for now. Mike Michael L. Conn Owner/Principal Consultant Mikon Consulting (408)727-5697 *** Serving Your Needs with Technical Excellence *** ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list Old list archives are viewable at: http://www.qsl.net/wb6tpu