Hi, I have been having problems in designing STM1 electrical interface to pass return loss requirement (< -15 dB up to 240MHz). We don't have a 3D full wave tool in house so I can't really simulate the interface and provide proper design guidelines. My question, what will be the best coax to PCB transition (75 ohm vertically-mounted SMZ connector): 1. a microstrip, where center conductor of SMZ is connected to microstrip lines on PCB and the 4 ground pins are connected to the reference copper on PCB; 2. A coplannar waveguide structure, ground - signal -ground, where signal is connected to center conductor and ground is connected to ground pins on SMZ. As long as we maintain 75 impedance control, I don't see much difference in terms of return loss performance for the above two. Also, how significant will through hole via along the signal path affect return loss at 240 MHz (assume 0.093" thickness) ? Thanks for your input. Regards Perry -- Perry Qu SDN D & Q | 600 March Road Alcatel Canada | Ottawa, ON K2K 2E6, Canada DID: (613) 7846720 | FAX: (613) 5993642 ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu