[SI-LIST] Re: What is the acceptable minimum pre-preg thickness for volume manufacturing?
- From: steve weir <weirsi@xxxxxxxxxx>
- To: leeritchey@xxxxxxxxxxxxx, "Andresakis, John" <John.Andresakis@xxxxxxxxxxxxx>, "Gilles Aminot" <aminotg@xxxxxxx>, "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
- Date: Mon, 04 Sep 2006 23:39:52 -0700
Lee, did you mean August 2004? Joel's piece can be found on the 3M web site.
http://multimedia.mmm.com/mws/mediawebserver.dyn?6666660Zjcf6lVs6EVs66S73jCOrrrrQ-#search=%22%22printed%20circuit%20design%22%20%2B%22the%20history%20of%20embedded%22%22
Regards,
Steve.
At 11:34 AM 9/4/2006, Lee Ritchey wrote:
>There was an article in the August 03 issue of Printed Circuit Design
>magazine titled "The History of Embedded Distributed Capacitance," by Jole
>Pfeiffer of 3M showing that the patents held by Sanmina-SCI are invalid due
>to the existance of both prior art and prior patents.
>
>
> > [Original Message]
> > From: Andresakis, John <John.Andresakis@xxxxxxxxxxxxx>
> > To: Gilles Aminot <aminotg@xxxxxxx>; si-list@xxxxxxxxxxxxx
><si-list@xxxxxxxxxxxxx>
> > Date: 8/30/2006 8:45:29 PM
> > Subject: RE: [SI-LIST] What is the acceptable minimum pre-preg thickness
>for volume manufacturing?
> >
> > Gilles,
> >
> > Depending on the copper weight and the area of copper retained, you can
>use
> > lower than 4 mils. The situation is that Sanmina has a patent for
>forming a
> > capacitor plane in-situ, which is what you are trying to do. It makes no
> > difference whether you purchase a 2 mil core or use 2 mil prepreg between
>a
> > power and ground plane during pressing, it still is covered by patents.
> >
> > Best Regards,
> >
> > John Andresakis
> > Oak-Mitsui Technologies
> > (518) 686-8088
> >
> > -----Original Message-----
> > From: Gilles Aminot
> > To: si-list@xxxxxxxxxxxxx
> > Sent: 8/30/2006 10:44 PM
> > Subject: [SI-LIST] What is the acceptable minimum pre-preg thickness for
> > volume manufacturing?
> >
> > Hi All,
> > Is there a PCB guru out there who can tell me what is the minimum
> > recommended pre-preg thickness for volume manufacturing? I want to
> > increase inter-plane capacitance by reducing the pre-preg thicnkess
> > between my power and ground planes. Currently we are using a pre-preg
> > thickness of 4mils. I did some research and found that pre-preg comes in
> > thicknesses as low as 2mils. Can we go as low as 2mils between planes on
> > an FR-4 PCB designed for RoHS compliance and still have a board which
> > can be reliably built in high volume?
> >
> > Thanks in advance for your replies.
> >
> > Kindest Regards,
> > Gilles Aminot
> >
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