[SI-LIST] Re: What is the acceptable minimum pre-preg thickness for volume manufacturing?
- From: "Kenneth W. Egan" <kegan@xxxxxxxxxxxxx>
- To: <leeritchey@xxxxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Mon, 4 Sep 2006 14:02:19 -0500
Not necessarily.
I reviewed the patents cited in the article, and the claims are DISTINCTLY
different. Some were claiming multiple electrodes (planes) different core
sizes.
Zycon's patent was different, and since its been licensed to other
manufacturers, somewhat validates the patent, since they would be remiss not
to argue prior art rather than pay licensing fees for 17 years.
Often it is the case, where a concept seems to be prior art, but isn't.
No I don't work for Sanmina, nor am validating Zycon's (Sanmina's) ZBC
patent.
KWE
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of Lee Ritchey
Sent: Monday, September 04, 2006 1:34 PM
To: Andresakis, John; Gilles Aminot; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: What is the acceptable minimum pre-preg thickness for
volume manufacturing?
There was an article in the August 03 issue of Printed Circuit Design
magazine titled "The History of Embedded Distributed Capacitance," by Jole
Pfeiffer of 3M showing that the patents held by Sanmina-SCI are invalid due
to the existance of both prior art and prior patents.
> [Original Message]
> From: Andresakis, John <John.Andresakis@xxxxxxxxxxxxx>
> To: Gilles Aminot <aminotg@xxxxxxx>; si-list@xxxxxxxxxxxxx
<si-list@xxxxxxxxxxxxx>
> Date: 8/30/2006 8:45:29 PM
> Subject: RE: [SI-LIST] What is the acceptable minimum pre-preg
> thickness
for volume manufacturing?
>
> Gilles,
>
> Depending on the copper weight and the area of copper retained, you
> can
use
> lower than 4 mils. The situation is that Sanmina has a patent for
forming a
> capacitor plane in-situ, which is what you are trying to do. It makes
> no difference whether you purchase a 2 mil core or use 2 mil prepreg
> between
a
> power and ground plane during pressing, it still is covered by patents.
>
> Best Regards,
>
> John Andresakis
> Oak-Mitsui Technologies
> (518) 686-8088
>
> -----Original Message-----
> From: Gilles Aminot
> To: si-list@xxxxxxxxxxxxx
> Sent: 8/30/2006 10:44 PM
> Subject: [SI-LIST] What is the acceptable minimum pre-preg thickness
> for volume manufacturing?
>
> Hi All,
> Is there a PCB guru out there who can tell me what is the minimum
> recommended pre-preg thickness for volume manufacturing? I want to
> increase inter-plane capacitance by reducing the pre-preg thicnkess
> between my power and ground planes. Currently we are using a pre-preg
> thickness of 4mils. I did some research and found that pre-preg comes
> in thicknesses as low as 2mils. Can we go as low as 2mils between
> planes on an FR-4 PCB designed for RoHS compliance and still have a
> board which can be reliably built in high volume?
>
> Thanks in advance for your replies.
>
> Kindest Regards,
> Gilles Aminot
>
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