Hi, I'm designing a small chip. The inner balls (via) will be 30mil pitch. I have place to 12BGA/20Via or 20BGA/12Via. (using LDI 1mm 6L PCB / 16mil via / small ball ~11mil). What do you thing is recommended for better power delivery and thermal? Thanks, Motti --------------------------------------------------------------------- Intel Israel (74) Limited This e-mail and any attachments may contain confidential material for the sole use of the intended recipient(s). Any review or distribution by others is strictly prohibited. If you are not the intended recipient, please contact the sender and delete all copies. ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu