One of the assembly house that we have been using informed us that they have found a way to fill the via holes by reflowing the solder on a blank board first. But this will only work for vias of discrete components and not BGAs, since too much solder under BGAs can cause adjacent balls to short. It seems that conductive via plugging is still needed for small pin-pitch BGAs. Best regards, George -----Original Message----- From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of Vincenzo Kreft-Kerekes Sent: Tuesday, April 06, 2004 9:41 AM To: Raymond.Anderson@xxxxxxx; si-list@xxxxxxxxxxxxx; 'Sol Tatlow'; 'Patrick Jabbaz' Subject: [SI-LIST] Re: Vias on decoupling pads Is there a critical aspect ratio for drilled through vias at which the solder wicking becomes self-limiting to get an "auto-plugging" effect or would the via diameter have to be so small that it won't even plate? And I'm assuming there's not much point in first reflowing the board without components to fill the vias, i.e. plugging for the resource challenged? Best, Vincenzo -----Original Message----- From: Ray Anderson [mailto:Raymond.Anderson@xxxxxxx] Sent: Tuesday, April 06, 2004 12:00 PM To: vincenzo@xxxxxxxxxxxxxx; si-list@xxxxxxxxxxxxx Subject: Re: [SI-LIST] Re: Vias on decoupling pads Vincenzo Kreft-Kerekes wrote: > I've always wondered about this, from both the design and manufacturing > standpoint, how is a via-in-pad any different from a via with a non-circular > capture pad? Why would you use a microvia instead of lets say a 14 mil via > in the center of a 40x40 mil 0603 pad which would practically be a large via > capture pad with corners? Why would a fab house worry about the shape of the > capture pad, they don't seem to handle octagonal capture pads for through > hole vias differently? Or plane stitching vias with practically board size > capture pads? Thanks a lot for your help. > > Best, > Vincenzo > The issue is with the solderability of components to the pads after the bare pcb is fabbed. If the via hole is too big or unfilled, your solder may wick down the hole causing insufficient solder on the pad. -Ray ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu