[SI-LIST] Via-In-Pad or Via-Next-To-Pad - which is best?
- From: "JP Nicholls" <jpnicholls@xxxxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Mon, 4 Nov 2002 14:30:52 -0000
Which has the minuimum inductance for a decoupling cap:
1. Blind via-in-pad with via diameter of 0.15mm finished,
extending from layers 1 to 5 in a 6-layer board, OR
2. Tracking to an immediately-adjacent 0.7mm pad, 0.3mm
finished blind via,extending from layers 1 to 5 in a 6-layer
board?
Many thanks,
--
JP Nicholls / jpnicholls@xxxxxxxx
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