[SI-LIST] Re: Via Structure
- From: steve weir <weirsi@xxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Thu, 19 Apr 2012 07:40:00 -0700
The capture pad and antipad geometries both affect the amount of
parasitic capacitance the via has with each layer.
This sounds more like a Gerber aperture translation error than a DFM
decision by the board house.
Steve.
On 4/19/2012 7:15 AM, Filion, Marc-Andre wrote:
> Hi,
>
>
> We had a funny surprise when we received the bare pcb of a prototype. The PCB
> fab changed the via pad from a typical round shape to an enlarged square one.
> It tickle our mind and came to a quick conclusion that it won't affect much
> the signal integrity.
>
>
>
> My question here is: Is this a more effective way to build PCB (in term of
> yield)? Is there any pitfall related to this technique?
>
>
>
> best regards,
>
> Marc-André Filion, Eng | Hardware designer | Kontron Canada | T 450 437 5682
> x2243 | E
> marc-andre.filion@xxxxxxxxxxxxxx<mailto:marc-andre.filion@xxxxxxxxxxxxxx>
>
> Kontron Canada Inc
> 4555 Rue Ambroise-Lafortune
> Boisbriand (Québec) J7H 0A4
>
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