[SI-LIST] Via Modeling Webinar - Vias Minus the Mystery

From: Ronda Katz <rkatz@xxxxxxxxxx>
To: si-list@xxxxxxxxxxxxx
Date: Fri, 03 Apr 2009 12:19:00 -0400
SiSoft Invites You to a Via Modeling Webinar , "Vias Minus the Mystery",
on Tuesday, April 14th at 1:00 PM EST.

Dr. Michael Steinberger, author of the award-winning paper, "A Simple Via 
Experiment", will be
presenting.

Register online now
http://www.sisoft.com/via_webinar_si.htm

Make Better Engineering Decisions When You Understand What’s Behind the
Physics of Vias.

This complimentary webinar will focus on the following topics:

    * An explanation of the physics of vias as well as the interaction
      between vias
    * How to use the physical explanation of vias described here to
      enhance engineering judgment in the design of vias
    * Measured Data, Matching Theoretical Calculations, Matching Field
      Solver results, and Basic Physical Reasoning which demonstrate the
      role of radial TEM waves in the electrical behavior of vias
    * Presentation of a small number of engineering approximations
      sufficient to make most engineering decisions concerning vias

For many years, our understanding of the high frequency electrical
behavior of vias in PC boards and packages has been at best incomplete,
and more recently vias have been portrayed as the exclusive province of
experts running 3D field solver programs. The fundamental problem is
that there has not been any explanation of the physics of vias that
would enable engineers to visualize the currents and fields, and
therefore exercise engineering judgment in the design of vias.

While the increasing data rates of high-speed serial channels makes it
more important than ever to fully understand the electrical behavior of
vias, we do now have an explanation for the physics of vias which is
suitable for engineering use. A very simple experiment, for which closed
form solutions to Maxwell’s equations match measured data and field
solver results, demonstrates that the ground return path for a via can
be explained in terms of radial TEM waves propagating between pairs of
ground planes. Furthermore, this explanation can be extended to explain
the interaction between vias.

This webinar will present measured data, matching theoretical
calculations, field solver results, and basic physical reasoning which
demonstrates the role of radial TEM waves in the electrical behavior of
vias. Additional measured data and the concept of radial TEM waves is
then used to explain how vias interact. The result is a small number of
engineering approximations which are sufficient to make most engineering
decisions concerning vias.

Register online now
http://www.sisoft.com/via_webinar_si.htm


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[SI-LIST] Via Modeling Webinar - Vias Minus the Mystery

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