[SI-LIST] Re: Using of Distributed Package model for simulation
- From: "Harjeet Singh Randhawa" <harjeet.randhawa@xxxxxxxxx>
- To: "Michael Khusid" <mkhusid@xxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Mon, 17 Feb 2003 10:42:55 +0530
Hello Michael,
Thanks for your answer. I have few basic questions. Kindly let me know
about them :
1. How can I know from the package files that it's coupled or
uncoupled? The package model is as shown below:
Driver -> Ldbmp-Rdbmp---Segment(L,R,C,Zo,Package
Trace)---Lvia-Rvia---Lland-Rland->ToSocket
2. The vendor has given me the RLCG matrix for the Segment. It is a 3
conductor model with frequency dependent RLC values specified in
matrices.
I know there is way to generate package.dml file from these RLCG
matrices. But again it has circuit models for both single and coupled
traces. How do you check for number of coupled traces to be used in
coupled circuit model and Do you really need it or not?
I would really appreciate your response?
Thanking in advance.
Regards,
Harjeet.
Sr Engineer - VLSI/System Design
Wipro Technologies
-----Original Message-----
From: Michael Khusid [mailto:mkhusid@xxxxxxxxxx]
Sent: Sunday, February 16, 2003 9:00 AM
To: Harjeet Singh Randhawa
Subject: RE: [SI-LIST] Using of Distributed Package model for simulation
You have a couple of options.
1. If the package is uncoupled, then you can convert the SPICE file to
.ebd
IBIS format.
1. If the package model is coupled, you can convert it to the
IBIS-compatible .pkg format. For details, see IBIS 3.2 spec, Section 7.
http://www.vhdl.org/pub/ibis/ver3.2/
You may want to request the package model in form of a RLC matrix
instead of
Spice netlist to simplify the conversion.
2. Ansoft TPA (turbo package analyzer) supports coupled package model
export in SPICE as well in DML form. Check with your package vendor if
they
are using TPA -- it will take no time for them to create a .dml file for
you.
Best regards,
-----------------------------------------------------------------
Michael Khusid
Ansoft Corporation
SI/HF Application Engineer
25 Burlington Mall Road, 6th floor
Burlington, MA 01803-4100
Tel 781-229-8900 Ext. 34
Fax 781-229-8624
--------------------- http://www.ansoft.com ---------------------
-----Original Message-----
From: Harjeet Singh Randhawa
To: si-list@xxxxxxxxxxxxx
Sent: 2/15/03 12:28 AM
Subject: [SI-LIST] Using of Distributed Package model for simulation
Hi All,
I am using an Intel Xeon processor in my design. I have got the ibs
model for the processor and separate distributed package model in
H-Spice .rlc format. Is there a way to integrate this package model into
the ibs model, so that postlayout check becomes seamless.
Also I am using cadence Si tool which needs .DML models. Ultimately I
need to get a .DML model consisting of both package info and device
buffer info.
Thanking in advance for your suggestions.
***************************
Harjeet Singh Randhawa
Wipro Technologies
8520408. Xtn 4113.
www.wipro.com
***************************
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