Boards, Chips and Packaging--Designing to Maximize Results takes place on
October 13, 2015 at the Computer History Museum in Mountain View California. Of
particular interest will be the panel session, How Do We Get to Next-Generation
High Speed Data Transfer Rates? Included on this panel are high-speed design
technology experts, Lee Ritchey and Scott McMorrow. Panel participants will
discuss where the industry is now in terms of meeting bandwidth demands, how
long-held design technologies are being maxed out in terms of their
capabilities and efficiencies and what, from the technology "building block"
perspective needs to happen next. To register for the conference, please go to
www.semico.com <http://www.semico.com>
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