[SI-LIST] Re: Trace width selection for high speed serial links

  • From: wolfgang.maichen@xxxxxxxxxxxx
  • To: wolfgang.maichen@xxxxxxxxxxxx
  • Date: Mon, 31 Aug 2009 09:40:12 -0700

just to avoid possible misunderstandings, in the previous post "thick 
traces" was supposed to say "wide traces".
Wolfgang







wolfgang.maichen@xxxxxxxxxxxx 
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08/31/2009 09:33 AM

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[SI-LIST] Re: Trace width selection for high speed serial links






JF,
purely for minimization of skin effect loss, the wider the traces, the 
better. So 10 mils will have lower losses than 4 mils (although the 
improvement is less than you may expect, which is due to the fact that the 

current tends to crowd at the - sharp - edges of the trace). The trace 
width that gets used eventually is always a compromise between many 
different factors, and skin loss is just one of them. Some possible 
problems with thick traces are

- require thick dielectric layers to achieve 50 Ohm impedance - that makes 

for thicker boards, which in turn will worsen via parasitics

- can be difficult to route inside a dense BGA via grid; if you have to 
neck down the wide trices to make them pass between adjacent vias you 
incure impedance discontinuities. Due to same reason (dense BGA grid), the 

traces will come very close to each other, which will increase crosstalk 
compared to thinner traces.

- require wider trace spacings, which reduces routing density and possibly 

forces you to use more layers (added cost and even thicker boards)

Advantages are lower skin losses and also smaller relative etch 
tolerances, thus potentially better impedance control.

Of course there are many more parameters to look out for on a real design.

Wolfgang






jhasson@xxxxxxxxxxxxxxxxxxx 
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08/31/2009 09:21 AM

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[SI-LIST] Trace width selection for high speed serial links






Hi,
It is often mentionned in guidelines for routing high speed differential 
serial links to have a trace width between 4 and 8 mils to reduce skin 
effect losses. What would be the drawback of having even larger traces 
like 10 or 12 mils if any ? The setup would be to use loose coupling and 
the board density is not the main concern.

Best regards,

JF Hasson

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