[SI-LIST] Re: Thermally Conductive Adhesives
- From: Brian Rautio <brian@xxxxxxxxxxxxxxxxxx>
- To: Arjun Bingipur <Arjun.Bingipur@xxxxxxxxxxxxxxxxx>
- Date: Fri, 6 Jan 2012 12:01:20 +0000
Not really an SI question but an easy answer.
The information you're looking for is limited (or non-existent) because the
application isn't as you are thinking. Thermal paste is not a replacement for
"conventional copper heatsinks," but rather an agent used to fill in any air
gaps resulting from roughness in the interface between a die/IC/package/etc.
and the heatsink material itself. Without it, such air gaps serve as an
unfortunately good thermal insulator. Some thermal pastes include an epoxy or
adhesive to mechanically fasten the heatsink as well.
Thanks,
Brian
On Jan 6, 2012, at 6:48 AM, Arjun Bingipur wrote:
> Hi,
> I would like to ask the experts a question at the risk of it being non-SI
> related.
>
> I'm in the process of evaluating Heat Sink Paste technology instead of
> conventional copper heat sinks.
>
> Although there are very good technical papers on thermally conductive
> adhesives and various other technical specifications, the information is
> quite limited when it comes to actual application.
>
> I would like to hear from the group if there are any real time success
> stories used in mass production? Failure modes? Trade offs? Any one tried
> it especially in the Automotive industry?
>
> Any information will be much appreciated.
>
> Regards,
> Arjun
>
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