Dear List Members,         Our new product fails in thermal. The plastic casing temperature reaches 60 deg. 'C' (room temperature about 24 deg. 'C') and temperature at the surface of one of the 4 IC reaches about 73 deg. 'C'. The plastic casing hard tooling is finalised and redesigning the tool is not feasible at this stage.          I would like to know others experience in a similar situation. Will it be possible to find a solution by doing thermal simulation / analysis and by redoing the PCB layout (size, thickness are fixed). So far we have not done any thermal simulation for any of our product and we don't have any exposure to thermal simulation.        Functionally the product is a success and tested for about 96 hours continuously at 25 deg. 'C' room tempertaure without any issues. We are planning to run functional tests at 45 deg. 'C' for about a week to assess the reliability at elevated temperature. But the user feedback will be negative because of the heat (about 60 deg. 'C') at the device housing.    My question to the forum is "What is the confidence level in finding a solution through thermal simulation / analysis with the given constraints." Bharath Unlimited freedom, unlimited storage. Get it now, on http://help.yahoo.com/l/in/yahoo/mail/yahoomail/tools/tools-08.html/ ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu