[SI-LIST] Re: Solving signal integrity problems at very high data rates - EDN

  • From: Istvan Novak <istvan.novak@xxxxxxxxxxx>
  • To: antokdavis@xxxxxxxxx, "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
  • Date: Wed, 12 Oct 2016 09:15:28 -0400

Hi Anto,

Maybe a slight clarification makes the quoted statement easier to accept.

I think what that sentence wants to say is that the overall via capacitance

becomes like a transmission-line capacitance; it does not disappear, but

is distributed.  Of course the usual 'it depends' applies: this statement

is a good approximation as long as the biggest vertical spacing in the 
stackup,

namely the thickest dielectric or thickest conductor is still much less than

the wavelength of the highest frequency of interest.

Regards,

Istvan Novak

Oracle



On 10/12/2016 8:47 AM, Anto Kavungal Davis wrote:

Hi,
I was going through Solving signal integrity problems at very high data
rates - EDN, by
Lee Ritchey, Scott McMorrow & Kella Knack -October 04, 2016
Any papers/publications based on the following comment or with similar
results.

"What has been demonstrated by simulations as well as by laboratory
measurement is that when a signal travels the length of the plated through
hole or via, the parasitic capacitance of the hole is distributed along the
length of the hole, rendering it virtually invisible."

Thanks,
Anto




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