[SI-LIST] Re: Solder & Paste Mask Properties
- From: Bill Dempsey <BDempsey@xxxxxxxxxxxx>
- To: "'dhoovy@xxxxxxxxxxxxx'" <dhoovy@xxxxxxxxxxxxx>,"'AdeelM@xxxxxxxxxxxx'" <AdeelM@xxxxxxxxxxxx>,"'si-list@xxxxxxxxxxxxx'" <si-list@xxxxxxxxxxxxx>
- Date: Wed, 15 May 2002 12:04:12 -0500
Just to keep everyone's vocabulary straight --
LPI on a via does not constitute plugging or tenting. So let's not
propagate incorrect terms.
LPI on a via is a common practice but the process is not the same as
tenting.
Tenting involves dry film solder mask where it truly makes a tent across the
hole of the via.
Plugging is a process where (typically) epoxy is squeezed into the via hole.
These techniques are used in ruggedization and for testing assembled boards
that have vacuum applied to one side. Others could better comment on this
process.
But to address the first question -- if you select "tenting" and choose to
use a LPI soldermask then you will coat the via with soldermask. But you
have not truly tented the via.
Regards,
Bill
> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx
> [mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of David Hoover
> Sent: Tuesday, May 14, 2002 11:36 PM
> To: AdeelM@xxxxxxxxxxxx; si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Re: Solder & Paste Mask Properties
>
>
>
> Well I know what "tenting" is. Tenting is a method of having
> the soldermask
> image being a solid ink across the via (pad and all). Today's PCBs are
> really more of a "via plugging" because today's LPI's don't
> tent worth a
> darn.
> I'm not so sure about the "over-ride"option except maybe the
> opposite where
> the full via pad is exposed (like in the case of an ICT test
> probe location
> on the
> opposite side of the BGA component).
>
> Cheers,
>
> David Hoover
> Field Application Engineer
> Data Circuit Systems
> (408) 280-0422 X233
> (408) 219-7711 cell
> http://www.datacircuits.com
> ----- Original Message -----
> From: "Adeel Malik" <AdeelM@xxxxxxxxxxxx>
> To: <si-list@xxxxxxxxxxxxx>
> Sent: Tuesday, May 14, 2002 3:10 AM
> Subject: [SI-LIST] Solder & Paste Mask Properties
>
>
> >
> > Some PCB Design Softwares support an advanced option while
> setting the
> > properties of the pads and vias. This option is reflected
> in the Solder
> Mask
> > and Paste Mask layers and the option is whether you want to
> use 'Tenting'
> or
> > 'Over-ride' while masking the pads or vias. Can someone
> tell me what do
> the
> > terms 'tenting' and 'over-ride' indicate and whats the advantage in
> > specifying them ?.
> > Regards,
> > Adeel
> >
> >
> >
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