[SI-LIST] Re: Skin depth,copper,gold

  • From: "Mahesh@cmrda" <mahesh@xxxxxxxxx>
  • To: si-list@xxxxxxxxxxxxx
  • Date: Tue, 08 Oct 2013 07:56:40 +0530

At 10 Ghz , in gold skin effect depth is 0.7 microns
What is the gold plating thickness in ENIG ?


On 08-10-2013 07:23, Yuriy Shlepnev wrote:
> Bala,
>
> Yes, you definitely have to consider the properties of the plating materials
> too, especially in the case of ENIG plated traces. A broadband model of ENIG
> plated traces must include properties of all 3 materials - copper, nickel
> and gold. Otherwise the model is not accurate enough for the analysis of
> multi-gigabit data channels.
> See overview, analysis and experimental data for ENIG plated traces at
> Y. Shlepnev, S. McMorrow, Nickel characterization for interconnect analysis.
> - Proc. of the 2011 IEEE International Symposium on Electromagnetic
> Compatibility, Long Beach, CA, USA, August, 2011, p. 524-529.
> The paper is available at IEEE site
> http://ieeexplore.ieee.org/xpl/login.jsp?tp=&arnumber=6038368&url=http%3A%2F
> %2Fieeexplore.ieee.org%2Fxpls%2Fabs_all.jsp%3Farnumber%3D6038368
> You can also find the paper and presentation at www.kb.simberian.com (in
> Publications and Presentations sections, require registration).
>
> Best regards,
> Yuriy
>
> Yuriy Shlepnev, Ph.D.
> President, Simberian Inc.
> 3030 S Torrey Pines Dr. Las Vegas, NV 89146, USA
> Office +1-702-876-2882; Fax +1-702-482-7903
> Cell +1-206-409-2368
> Skype: Shlepnev
>
> www.simberian.com
> Simbeor - Accurate, Fast, Easy and Affordable Electromagnetic Signal
> Integrity Software
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>
>
> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
> Behalf Of bala
> Sent: Saturday, October 05, 2013 2:47 AM
> To: si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Skin depth,copper,gold
>
> Hi all,
> When I model my surface microstrip trace,generally,I am taking properties of
> copper into consideration.and if my copper plated with gold or nickel,I am
> suspecting if we really need to consider the properties of plating material
> as well.One of the document says ,based on your skin depth choose your
> material property.My question is at low freq my signal uses my entire cross
> section(copper+gold) and at high frequency my skin depth shrinks and my
> signal uses outer surface of my conductor(gold on top side ,copper on bottom
> side).In both cases I should take both properties.How skin depth plays a
> role in choosing the material property (copper or both)while modeling
> microstrip?
> Regards
> bala
>
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