[SI-LIST] Re: Shield ground isolation - logic/chassis ground connection
- From: JMurphy@xxxxxxxxxxxxxxxxx
- To: si-list@xxxxxxxxxxxxx
- Date: Mon, 24 Feb 2003 14:36:30 -0500
All,
For circuit packs and chassis, should the pack's logic ground planes be
contiguous and connected to the metal faceplate with plated through-holes
thus connecting logic ground to chassis ground? Currently, the packs have a
chassis ground planes along the front edge of the pack which provide holes
for mounting the bracket. Logic grounds are separated from this chassis
ground with a gap. I've placed pads at each of the five through-holes for
the bracket to allow logic and chassis to be connected or not based upon EMC
testing.
There are some unshielded I/O which are filtered using transformers and
chokes. Connectors are metal and connected to the faceplate (chassis) by
contact. I've had good luck using this scheme during EMC testing.
The idea of having the option to isolate chassis from logic ground is for
ESD, EFT, etc. immunity. Those test signals are referenced to chassis
ground and keeping all offending currents on the outside of the shield
(enclosure) would boost the system's immunity.
Thanks in advance for any assistance. Grounding gets me every time. What
to do with logic grounds and chassis for systems that operate into several
hundred MHz and has unshielded I/O ports.
Jack
-----Original Message-----
From: npischl <npischl@xxxxxxxxx> [mailto:npischl@xxxxxxxxx]
Sent: Monday, February 24, 2003 2:05 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: Shield ground isolation
Annand,
In addition to other good replies you received on the list:
With shielded cabling, for low emission you need to minimize common-
mode (CM) currents that flow on the exterior of the shield. In
general, is not true that it is achieved by disconnecting the logic
ground from shield ground. What is needed is high transfer impedance
of the overall shield. Transfer impedance of a shielded cable for
example is the (intentional signal) voltage between the center
conductor and the shield divided by the CM current that flows on the
exterior due to imperfections. If the cable shield is perfect, and
the source and the load are perfectly terminated with 360-degree
connection around the ends, the transfer impedance is very high
(no "leakage") and the emission is low.
You can easily expand the concept to the overall shield, including
the "box", except that the definition of the driving voltage may
become little more ambiguous. In most systems you will deal with, the
two main causes of increased emission from unshielded cables will be
imperfect connection of the shield at the connectors (pigtails), or
compromised shielding-integrity of the chassis (e.g. a slot). They
both let CM currents flow on the exterior of the shield and cause
emission.
Trying to "disconnect" the two metals (digital and shield) will not
work well because, you want it or not, they are connected by their
mutual impedance (C in the first place) anyways. This impedance lets
current flow between them. This may also create serious functional
problems when the cable shield is used as a reference (I have seen it
unfortunately many times).
It is important to keep continuous and low-impedance current path for
both the intentional and CM signals, while minimizing external CM
currents (maximize transfer impedance). This can be done by
connecting the signal GND and the shield together at the connector,
and maintaining low-impedance continuous connection for the
intentional signals and 360 degree (or best approximation) of the
cable-shield. The result is that the intentional signal current
returns through low-impedance and that CM voltage at the connector
(mainly the voltage between the PCB GND and the shield) is low, thus
CM current on the cable is also minimized. What it does is that it
lets CM current return to its source withini the box, instead of
getting on the exterior of the shield.
If doing so doesn't reduce emission from the shielded cable, you need
to look at the shield-integrity of the box that is most likely
compromised. Since we live in an imperfect world, sometimes you may
see it happen, but it does not prove that disconnecting the signal
from the shield is necessary for good EMC. Quite opposite is
generally true.
The only exception that may sometimes validate disconnecting the two
may be if you drive the I/O through transformers or some other means
of isolation. Even then, it depends on how much isolation (e.g. C
between primary and secondary or across an optocoupler) you really
have.
Neven
--- In si-list@xxxxxxxxxxxxxxx, "Kuriakose, Anand"
<Anand.Kuriakose@xxxx> wrote:
>
> Hi All,
>
> On high speed boards with I/O connections running to outside world,
the
> shield ground of the connectors should be isolated from the digital
ground
> if the board has to meet the requirements of EMI/EMC compliance
standards.
>
> Are there any side-effects of isolating the shield ground from the
digital
> ground?
>
>
> I have seen on some boards, that the isolation is achieved by using
ferrite
> beads. On few others i have seen capacitors being used b/n shield
and
> digital ground.
>
> How are capacitors useful in acheiving isolation? Or are these caps
used for
> some other purpose, which i am not able to understand?
>
> What is the best method to achieve this isolation?
>
> Thanks in advance.
>
> Regards,
> Anand.
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