Hi Bala, Hmmmm, where to start? My first thought is that is a very open ended question. You obviously have thoughts regarding why it shouldn't be this way. If you tell me why, the answer to your real question will probably be alot simpler and less convolute. Are you considering PDN from source to die, just PCB, or somewhere else in the path, like package only? Depending on where you are looking and how broad your view is, you may very well have practical implementable frequency limitations. Just looking at PCB? Buried capacitance not an option (cost)? Well then, you may very well have a tighter frequency bounding on what you can do, or can't "do" where you are looking. With alot of the low voltage high current parts on parts today, simple IR drop from source to package at DC load may be a big chunk of the problem. Ran into a problem where someone dropped copper on power layer from 1oz to 0.5oz for cost. Low voltage high current path with snakelike distribution path. Halve the copper and double the resistance of the path. Doubling the IR drop was a big issue in this case. So, if you can tell us what you are trying to solve and where, your answer will probably be alot clearer. Then again, if you are in a position of being able to do PDN, high speed channel co-simulation, then doing the sims will show the impact of what you do in the PDN frequency solution space. Like others have said, there are a ton of papers regarding what you need to consider and why. Just let me know. -Michael. We will either find a way or make one - Hannibal In the middle of every difficulty lies opportunity - Al Einstein If you think you can do something or you think you can't, in both cases you are probably right - H Ford If you're not getting the results you want with the current approach, move on and try something else. - A. Fleischmann On Fri, Nov 23, 2012 at 2:31 PM, Istvan Novak <istvan.novak@xxxxxxxxxxx>wrote: > Bala, > > It does not necessarily has to be that way. You always have to check > what is the bandwidth of the signal or noise current hitting the PDN, > and evaluate it against the various functions of the PDN you expect > it to perform. For a brief generic summary you can look at the paper: > > Focused Issue Feature: A New Dawn in R&D > IEEE Microwave Magazine, August 2011 > at http://www.electrical-integrity.com/ >> Paper download. > > Regards, > > Istvan Novak > Oracle > > > bala wrote: > > > > Hi all, Why self impedance analysis of Power Distribution Network has > > to be done upto IO's operating frequency? > > -- bala > > > > > ------------------------------------------------------------------ > To unsubscribe from si-list: > si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field > > or to administer your membership from a web page, go to: > //www.freelists.org/webpage/si-list > > For help: > si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field > > > List forum is accessible at: > http://tech.groups.yahoo.com/group/si-list > > List archives are viewable at: > //www.freelists.org/archives/si-list > > Old (prior to June 6, 2001) list archives are viewable at: > http://www.qsl.net/wb6tpu > > > -- ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List forum is accessible at: http://tech.groups.yahoo.com/group/si-list List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu