[SI-LIST] SPI 2006 - Call For Participation: Program now available
- From: Andre Grabinski <agra@xxxxxxxxxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Mon, 10 Apr 2006 16:17:57 +0200
Please consider the following announcement and accept our apologies in ca=
se of multiple copies.=20
Call for Participation
10th IEEE WORKSHOP ON
SIGNAL PROPAGATION ON INTERCONNECTS
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D THE PROGRAM IS NOW AVAILABLE! =3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D
You can download the program from http://www.spi.uni-hannover.de .
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D
May 09-12, 2006
Dorint Sofitel Schweizerhof Berlin, Berlin-Mitte, Germany
Sponsored by the IEEE Computer Society -- Test Technology Technical Counc=
il (TTTC) and by the IEEE Components, Packaging, and Manufacturing Techno=
logy (CPMT) Society
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D IMPORTANT: HOTEL RESERVATION =3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D
As you supposably know, Germany will host the soccer world cup this year.=
On this account hotel rooms might soon be getting rare. Therefore we str=
ongly recommend to make your hotel reservation as soon as possible. You w=
ill find all essential information on hotel reservation on our website as=
well: http://www.spi.uni-hannover.de/reservation_information.html .
PLEASE TAKE THIS NOTE SERIOUSLY !!!
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=3D=
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About SPI:
During the last nine years, the IEEE Workshop on Signal Propagation on In=
terconnects has been developed into a forum of exchange on the latest res=
earch results in this area. The aim of this ensuing workshop is to report=
on the most recent developments in the field of interconnect modeling, s=
imulation and measurement on chips, boards, and packages. The event is al=
so meant to bring together developers and researchers from industry and a=
cademia in order to encourage cooperation. In view of the last years' suc=
cess, the committee is looking forward to the 10th IEEE Workshop on Signa=
l Propagation on Interconnects where world class developers and researche=
rs will share and discuss leading-edge results in the famous and historic=
city of Berlin, Germany. The social events bundle takes care you'll neve=
r forget where you learned about the latest news on interconnects and tes=
ting: we are going to have a guided sightseeing tour through Germany's ca=
pital city followed by an excellent dinner. The workshop will be held in =
English. We are looking forward to see you in Berlin. =20
Main topics of the workshop will include, but are not limited to:=20
- Frequency Domain Measurement Techniques=20
- Time Domain Measurement Techniques=20
- Modeling Techniques of Package & On-Chip Interconnects=20
- Macro-Modeling=20
- Simulation Techniques for Interconnect Structures=20
- Electromagnetic Field Theory=20
- Analysis and Modeling of Power Distribution Networks=20
- Propagation Characteristics on Transmission Lines=20
- Coupling Effects on Interconnects=20
- Substrate Effects=20
- Guided Waves on Interconnects=20
- Radiation & Interference=20
- Electromagnetic Compatibility=20
- Power/Ground-Noise=20
- Testing & Interconnects=20
- Optical Interconnects=20
Workshop Standing Committee:=20
Flavio G. Canavero, Politecnico di Torino, Dipartimento di Elettronica, T=
orino (I);=20
canavero@xxxxxxxxx=20
Hartmut Grabinski, Univ. Hannover, Laboratorium fuer Informationstechnolo=
gie, Hannover (D);=20
grabinski@xxxxxxxxxxxxxxxxxxx=20
Michel S. Nakhla, Carleton University, Department of Electronics, Ottawa =
(CAN);=20
msn@xxxxxxxxxxxxxxx=20
Jose E. Schutt-Aine, Univ. of Illinois at Urbana-Champaign, Center for Co=
mp. Elm., Urbana (USA);=20
jose@xxxxxxxxxxxxxx=20
Madhavan Swaminathan,=20
Georgia Institute of Technology,=20
Atlanta (USA);=20
madhavan.swaminathan@xxxxxxxxxxxxxx=20
Chair:=20
Hartmut Grabinski, Laboratorium fuer Informationstechnologie, Schneiderbe=
rg 32, 30167 Hannover (Germany) Phone +49-511-762-5030; Fax +49-511-762-5=
051=20
grabinski@xxxxxxxxxxxxxxxxxxx=20
Program-Chair:=20
Uwe Arz, Physikalisch-Technische Bundesanstalt, On-Wafer Microwave Measur=
ements (2.23), Bundesallee 100, 38116 Braunschweig (Germany) - Phone +49-=
531-592-2297; Fax +49-531-592-2228 =20
uwe.arz@xxxxxx=20
Technical Program Committee:=20
R. Abhari, Univ.McGill (Ca)
T.R. Arabi, Intel (USA)
W. Bandurski, Univ. Poznan (PL)
A. Cangellaris, Univ. Illinois (USA)
J.L. Carbonero, ST (F)
E. Chiprout, Intel (USA)
D. Deschacht, Univ. Montpellier II (F)
A. Deutsch, IBM (USA)
T. Dhaene, Univ. of Antwerp (B)
E. Griese, Univ. Siegen (D)
P. Gunupudi, Univ.Carleton (Ca)
H.-J. John, Siemens VDO Automotive AG (D)
G. Katopis, IBM, Poughkeepsie (USA)
R. Khazaka, Univ.McGill (Ca)
I. Maio, Politecnico di Torino, Torino (I)
J. Niehof, Philips Research Laboratories (NL)
P. Nordholz, Infineon, Munich (D)
H.J. Pfleiderer, Univ. Ulm (D)
B. Ross, Teraspeed Consulting Group, (USA)
A. Rubio, Univ. UPC Barcelona (E)
A.E. Ruehli, IBM, Yorktown Heights (USA)
E. Sicard, INSA, Toulouse (F)
G. Sommer, Infineon, Munich (D)
N. van der Meijs, Univ. Delft (NL)
A. Weisshaar, Oregon State Univ. (USA)
T.M. Winkel, IBM, B=F6blingen (D)
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