Microprocessor Packaging Group at Oracle has a position for a Packaging Engineer with experience in SI and PI. More details posted on Oracle Career web site at http://www.oracle.com/corporate/employment/index.html https://irecruitment.oracle.com/OA_HTML/OA.jsp?page=/oracle/apps/irc/candidateSelfService/webui/VisVacDispPG&OAHP=IRC_EXT_SITE_VISITOR_APPL&OASF=IRC_VIS_VAC_DISPLAY&akRegionApplicationId=821&transactionid=1961365186&retainAM=N&addBreadCrumb=RP&p_svid=1358757&p_spid=1409644&oapc=7&oas=vtNAQ1pVp0BrxqGab2STxA.. Additional details section of the Job description gives some info about the type of work. Thanks Sreemala ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu
