[SI-LIST] SI/PI Positions at Oracle America

From: "sreemala.pannala@xxxxxxxxxx" <sreemala.pannala@xxxxxxxxxx>
To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
Date: Thu, 07 Feb 2013 12:01:35 -0800
Hi All,

       We have two positions open in the Semiconductor Packaging and PCB 
Technology Group. Detailed URLs are available at the end of this post, 
the job requisition numbers are IRC2059663, IRC2059666  and more info 
can be found at http://www.oracle.com/us/corporate/careers/index.html
Do send me an email if you need further information.

Thanks

Sreemala

------------------------------------------------------------------------

Brief Posting Description
=========================

Signal Integrity and Power Integrity positions (Location is Santa Clara 
or San Diego)

This positions will address package/Module design and Signal/Power 
integrity challenges in 25G and beyond designs for high end 
microprocessors as well as ASICs. On some projects, the positions need 
to be involved with End-to-End power integrity and channel analysis 
including I/O, Pkg, backplanes etc.

Responsibilities include:
-------------------------

* Use analytical and simulation tools to define package/module design 
requirements (technology, stackup etc) in the project conception stages 
and negotiate with chip/system teams on product specification

* Develop multi-signal package/module models over 50 GHz bandwidth and 
develop suitable test structures for model to measurement correlation. 
Come up with performance metrics for the various package technologies in 
order to meet 25G signal requirements

* Performing Power Integrity analysis for core as well as IO and 
generating power delivery network requirements with emphasis on model to 
measurement correlation

* Measure power distribution impedance in a system and demonstrate ways 
to map performance for various package/module technologies

* Support internal customers (chip,system teams) regarding 
package/module specifications, models and simulations

* Be on the lookout for new technologies (package/interposer/module 
technologies, capacitors, test structures, debug tools etc) that would 
enhance package design cost/performance benefits. Work with vendors to 
integrate emerging technology into packages.

Skills:
-------

* College Degree of BS/MS in electrical engineering with coursework in 
Electromagnetics. Ph.D preferred.

* About 7 years experience in signal integrity and package/PCB 
electrical design

* Familiarity with 2D/3D EM package design tools, Matlab, Cadence 
package design tool is a must

* Mentor junior package designers in the group

* Good knowledge of SerDes design and package/PCB layout constraints

* Excellent analytical, communication and documentation skills


URLs
----

https://irecruitment.oracle.com/OA_HTML/OA.jsp?page=/oracle/apps/irc/candidateSelfService/webui/VisVacDispPG&akRegionApplicationId=821&transactionid=1506082380&retainAM=Y&addBreadCrumb=S&p_svid=2059663&p_spid=2111985&oapc=17&oas=rlkV7Ld9Dql_fgkYScGDeA..

https://irecruitment.oracle.com/OA_HTML/OA.jsp?page=/oracle/apps/irc/candidateSelfService/webui/VisVacDispPG&akRegionApplicationId=821&transactionid=1506082380&retainAM=Y&addBreadCrumb=S&p_svid=2059666&p_spid=2111988&oapc=11&oas=YM_pRA4TY5wzPvedjOy6NA..


------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field

or to administer your membership from a web page, go to:
//www.freelists.org/webpage/si-list

For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field


List forum  is accessible at:
               http://tech.groups.yahoo.com/group/si-list

List archives are viewable at:     
                //www.freelists.org/archives/si-list
 
Old (prior to June 6, 2001) list archives are viewable at:
                http://www.qsl.net/wb6tpu
[SI-LIST] SI/PI Positions at Oracle America

Other related posts:
