[SI-LIST] Re: [SI-LIST]: Which tool is the best - LINPARdisc ussion
- From: steve weir <weirsp@xxxxxxxxxx>
- To: Chris.Cheng@xxxxxxxxxxxx
- Date: Wed, 21 Apr 2004 13:24:41 -0700
Chris, ferromagnetic material shows up in funny places like some plating,
and the nickel in discrete component terminations. It has never been
enough to be of concern to me though. His causality error has to be the
result of round-off similar to SPICE problems with long lines and high
resolution.
Regards,
Steve.
At 01:01 PM 4/21/2004 -0700, Chris Cheng wrote:
>Raj,
>Please see my comments.
>
> >1. If you are doing cables (say shielded twisted pair), it may be better
> >to use a Finite Difference or Finite Element based more general 2-D
> >software.
>
>I am not sure why FDM or FEM inheritedly is better than MoM even in closed
>boundaries. Can you explain ?
>
> >2. I do not think it handles dielectric loss.
>
>As mentioned in some response, it does model dielectric loss in 2.0
>
> >3. It does not handle magnetic materials and probably neither do most
> >commercial programs.
>
>I will be very worry if my PCB starts to have magnetic material behavior
>
> >4. If accurate skin effect inductance and resistance are important,
> >again, other programs which divide the area of cross-section into many
> >fine filaments would be needed.
>
>To a degree. Linpar does generate the R(sqrt(f)) skin effect model based on
>a fully pronounced skin depth assumption. One can argue whether this is good
>enough for thick traces at >GHz
>
> >5. It does not produce a HSPICE w-element compatible model directly.
>
>But you can now use the touchstone S params models in HSPICE.
>
> >6. I have already pointed out a minor problem I had with non-zero
> >forward crosstalk for a homogenous medium
>
>I will be very interested in the exact structure that generates this error.
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Steve Weir
Teraspeed Consulting Group LLC
2926 SE Yamhill St.
Portland, OR 97214
(503) 239-5536
http://www.teraspeed.com
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