[SI-LIST] Re: SI and CAD engineer job opportunities at Cisco in Shanghai, China

  • From: "Vadim Heyfitch" <heyfitch@xxxxxxxx>
  • To: "Bill Chen (billchen)" <billchen@xxxxxxxxx>
  • Date: Tue, 19 Feb 2008 10:40:43 -0800

apparently there is a shortage of SI engineers in China. Cisco should run a
TV advertisement that would say something like "...travel the world..." with
a few local super models and beautiful scenery in the background...
something like what the Army does  to attract the recruits.
What do they pay for such jobs in China anyway? Any perks? Health insurance?
HMO or a PPO?

-Vadim


On Feb 18, 2008 8:15 PM, Bill Chen (billchen) <billchen@xxxxxxxxx> wrote:

> Dear all;
>
>         I have several SI and CAD engineer positions available at  =
> Cisco R&D center in Shanghai China.=20
> Please see below for job description.
>
>         If you are interested, please submit your resume to me.
>
>
>  Thanks and Best Regards!
>
>
> Bill
>
> www.cisco.com
>
> *************************************************** Job Description for =
> SI Position **************************************************
> Electrical Engineer =A8C Signal Integrity and High Speed Design
>
> Location: Shanghai, China
>
> Job Description:
>
> As part of signal integrity and high speed design technology team, =
> design and analyze high speed analog/digital circuits for networking =
> products, with emphasis
>  on high speed signal and power analysis (especially timing and noise) =
> of ASICs, package and printed circuit boards.=20
> =20
> Model/simulate/characterize high speed systems, including high speed =
> I/Os, chip packages, printed circuit boards, and system interconnects.=20
>
> =20
>  Qualifications:
>
>
> *       Proficiency with spice (or equivalent) circuit simulation, 3D =
> field-solver and time/frequency domain analysis
> *       Experience with IBIS and SPICE simulation tools. Experience with =
> SpecctraQuest , XTK, ADS, ICS and HSPICE a plus=20
> *       Experience with 2D, 3D or High Frequency Field Solvers is
> required.=20
> *       Solid background on transmission line theory  is necessary
> *       Experience correlating simulation results with lab  measurements.
> *       Experience with packaging modeling is a big plus
> *       Self motivation, teamwork and strong communication skills are =
> essential
>
> *       Typically requires MSEE/CS or higher combined with 3-5 years of =
> related experience, or  BSEE/CS combined with 5-7+ yrs related =
> experience.
>
> *       Good English skills in speaking, reading and writing
> =20
>
> *************************************************** Job Description for =
> Package and HDI PCB Layout Position =
> **************************************************
> Electrical Engineer - PCB/Package Layout and Design
>
> Location: Shanghai, China
>
> Job Description:
>
>
> As part of high speed board design team, responsible for IC package and  =
> PCB layout design for networking products.=20
> Work closely with PCB fabrication house and engineers from board design, =
> signal integrity and manufacturing groups to perform new or cost =
> reduction=20
> PCB boards. You will be responsible for all aspects of PCB layout tasks =
> including parts placement, routing, verification, and creating final =
> design outputs.=20
>
> =20
> Qualifications:
>
> *       Minimum of 3 years experience working with Cadence Allegro tools.
> =
> Concept schematic capture experience is a plus.
> *       Proficiency with all aspects of IC Package / PCB design
> *       Strong experience in designing multi-layer, high density designs =
> utilizing 12 to 24 layers with 1500 or more components.=20
> *       Experience in HDI and IC package design is a big plus.=20
> *       Good knowledge of signal integrity requirement and noise /
> crosstalk =
> prevention
> *       Familiar with current industry Design for Test (DFT) and Design
> for =
> Manufacturing (DFM) practices.
> *       Basic knowledge of electronic manufacturing procedures and
> materials.
> *       Self starter with strong organizational, communications and =
> interpersonal skills, with the ability to work on short-cycle design =
> projects.
> *       Good interpersonal skill, ability to work effectively in a team =
> environment.=20
> *       Good English skills in speaking, reading and writing
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