Wow, I would sure like to learn how could an external capacitor on a PCB can be effective on reducing SSO noise on a highspeed system. Especially if it is placed underneath the package on a PCB and have to go through the PCB via, pad, package via inductance. Could you please educate me ? -----Original Message----- From: Jack Stone [mailto:mediwheel_js@xxxxxxxxx] Sent: Wednesday, July 16, 2003 1:04 PM To: fzanella@xxxxxxxxxxxx; bhenson@xxxxxxxxxxxx; Ken.Cantrell@xxxxxxxxxxx Cc: bill.panos@xxxxxxxxxxxxxxx; Chris Cheng; scott@xxxxxxxxxxxxx; si-list@xxxxxxxxxxxxx Subject: Re: [SI-LIST] Re: Reducing SSO noise in an FPGA Fabrizio, Yes this has been done in extreme cases whereby the analysis of the drivers/receivers, package stackup, routing, power distribution and proper noise immunity failed in the initial design of an ASIC. Or in some cases was not performed at all. The offset is enough to allow an 0603 with acceptable results. However reworkability and process errors can wreak havoc on your DPM's once the product goes out to market. jack ~ ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu