> A solution ofen used to couple split planes that is almost always > suggested is to connect the planes with an isolating capacitor. It may > come as a surprise to most of you that "apple" has a patent on that > solution. I know it surprised me. I wonder how much prior art exists of people already doing that before Apple's patent (got a date/patent no.?). I've seen plenty of IC application notes, years back, that suggested if not required separate analog and digital grounds. I've wondered if much of the reason for that has more to do with IC design (and the impossibility of having quiet on-die references in a DIP package), than with system/board design issues. Andy ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu