[SI-LIST] Question about power delivery to silicon in a BGA package
- From: Tegan Campbell <Tegan.Campbell@xxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Thu, 27 Mar 2003 12:26:27 -0700
All,
What is a reasonable resistance to expect in wire bonds? Looking for one of
those hated rules of thumb.
I know the answer will vary according to too many things to list here, but I
am getting information from a vendor that indicates there is 1
ohm(resistance only, inductance is a whole other ball of fun)per power/gnd
bond from the package to the die. They are spice modeling, and the only
answer I am getting to questions about the model is "trust us".
This impedance is forcing me to bias the core voltage above spec on the
outside of the package so the die sees the correct voltage. Problem is
there are other IC's on the same power system.
Any links/books/papers on the subject would be appreciated as well.
Thanks in advance,
Tegan Campbell
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