[SI-LIST] Power/Ground Net modeling in TPA ...
- From: "Neeraj Pendse" <cnepsc@xxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Mon, 11 Nov 2002 18:21:29 -0800
Hello all!
Ansoft TPA 4.1 allows a LUMPED RLC solution in ACTIVE MODE (equivalent
of Ansoft Q3D results). I have selected several of my planes as
"power/ground" planes, and selected a "plane extent" for the section of
the package I am interested in. There are N bond wires and M solder
balls on the VDD plane. I have been told that in the LUMPED SPICE
subcircuit, I should expect to see N+M-1 sources to the plane and 1
sink.
Can anyone help me with the TOPOLOGY in which this is calculated? To
state specifically, how do I connect this plane with N+M-1 sources and 1
sink in my circuit simulation? How do I interpret the R and L results in
the matrix?
If someone would be nice enough to draw a sketch for me, that would be
great, I will provide my fax number.
Thanks in advance!
- Neeraj Pendse
National Semiconductor Corporation
http://www.national.com/, NYSE: NSM
------------------------------------------------------------------
To unsubscribe from si-list:
si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field
or to administer your membership from a web page, go to:
//www.freelists.org/webpage/si-list
For help:
si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field
List archives are viewable at:
//www.freelists.org/archives/si-list
or at our remote archives:
http://groups.yahoo.com/group/si-list/messages
Old (prior to June 6, 2001) list archives are viewable at:
http://www.qsl.net/wb6tpu
Other related posts:
