[SI-LIST] Re: Power supply - Component Placement and Power Distribution.
- From: "Prasad Mangipudi" <Prasad.Mangipudi@xxxxxxxx>
- To: <prashanth_rajappan@xxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Thu, 30 May 2013 13:40:16 -0700
Prashanth,
You can make a simple correction as below to work stackup for you. You can
increase the dielectric thickness between Signal1 and Signal 2 to adjust PCB
thickness. Large gap also reduces coupling between the signal1/2. You can use
localized power pours for power supplies by placing regulators near to load.
Stitch the ground planes with vias when you are done with layout and for HF
signals switching reference (GND) planes.
TOP
GND
Signal1/localized Power pours
Signal2/ localized Power pours
GND
Bottom
Thanks,
Prasad
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] On
Behalf Of Prashanth Rajappan
Sent: Thursday, May 30, 2013 7:22 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Power supply - Component Placement and Power Distribution.
Hi all ,
We are currently working on Mixed circuit board which has RF(VUHF) and Digital
(FPGA and PSoC )circuitary .
The layer stack up is
TOP
GND
Signal1
Signal2
Plane
Bottom
We have 3 different power supply requirement for FPGA and related digital
circuitry and 3 different power supply for the RF tx/rx side Which is generated
form one main input power.
My doubt is which is the best way to distribute the power in the board.Should
all the power modules be in one location and the power to be distributed
through planes from that location or Should I spread the main power supply
through the planes and keep the derived power supply locally near to the
required IC.
Looking forward to comments and suggestions.
Thank you ,
Regards
Prasanth
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