Chris Cheng wrote: > there is > never a need for fancy decoupling scheme on PCB for properly design > processor and package. How, then, does one go about evaluating the problems (if there's one at all)? As a consumer of chips --without access to internals-- it seems to me that the only choice you have is the empirical: build, test, measure, correct, repeat. Board spins are expensive, particularly in the low-volume world. It might be much easier to pepper the board with a bunch of inexpensive "insurance" capacitors. ~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~~ Martin Euredjian eCinema Systems, Inc. voice: 661-305-9320 fax: 661-775-4876 martin@xxxxxxxxxxxxxx ecinema@xxxxxxxx www.ecinemasys.com ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu