[SI-LIST] Re: Power Supply Distribution/Filtering/Decouplin g Guide]
- From: Hal Murray <hmurray@xxxxxxxxxxxxxxx>
- To: si-list@xxxxxxxxxxxxx
- Date: Tue, 13 Jan 2004 20:26:29 -0800
> An other example of this is package size. I think larger, easier to
> route ( in the package and on the board ) are a better trade off but
> customers push on cost the forces us into smaller BGA substrates that
> offer poorer signal quality and more PCB layers so the component cost,
> not system cost, can be optimized.
Good point. Do you think it will catch on if people repeat it often enough?
How many designers currently ask about the number of layers needed to route
all the balls of a chip? Or how many caps are needed to make it work? or ...
Perhaps marketing depts should start looking at demo boards for their
competitors chips to point out these things. (and, of course, push back on
their designers if the competition is better)
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