[SI-LIST] Re: Plastic solder balls

  • From: Roger.Delbue@xxxxxxxxxx
  • To: kalevi@xxxxxxxxxx
  • Date: Sun, 27 Nov 2005 05:44:33 -0500

Hello All,

It looks like they are a lead free equivalent of the none eutectic balls
(high lead content / none collapsing balls) available today. If I remember
correctly, the price ratio of the 2 type of balls is about 5 to 1, not the
full package cost, just the balls. The most interesting aspect of this new
technology seems to be the improved second level reliability compared to
the standard balls.
In term of process, as I understand, this balls works on the lead free
assembly process (extended reflow temperatures do to the lead free process)
The polymer used has a decomposing temperature above 400DegC. The ball is a
copper plated thin plated polymer sphere, therefore I think it should work
on the standard leaded process.

About simulation, personally I have not done any, I have looked at the
results of measurements as well as simulation and up to 20-25GHz it does
not seems that there is any appreciable difference.

Roger



|---------+---------------------------->
|         |           "Kai Keskinen"   |
|         |           <kalevi@xxxxxxxxx|
|         |           m>               |
|         |           Sent by:         |
|         |           si-list-bounce@fr|
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|         |           11/16/2005 06:45 |
|         |           PM               |
|         |           Please respond to|
|         |           kalevi           |
|---------+---------------------------->
  
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  |       To:       <jkeeble@xxxxxxxxxxxx>, <si-list@xxxxxxxxxxxxx>             
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  |       cc:       (bcc: Roger Delbue/GENEVA/LECROY)                           
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  |       Subject:  [SI-LIST] Re: Plastic solder balls                          
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>----------------------------------------------------------------------------------------------------------------------------------------------|





Anyone have any idea of the price ratio of these interesting things with
respect to standard solder balls? Do they work on standard reflow lines
with
standard profiles? Trying to get any CEM to change to these is like trying
to stop the titanic with a row boat until you can prove it lowers their
costs when factored in throughout the entire product cycle. They look like
they are worth investigating.

Cheers,

-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx
[mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of Jon Keeble
Sent: Tuesday, November 15, 2005 6:57 PM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Plastic solder balls



This is a solder coated plastic ball, for use in BGA packaging.

http://www.sekisui.com.tw/eng/product/fcd_a05.htm

The manufacturer claims that the improved shapeholding characteristics of
their plastic bits provides improved SI.

When are the tool manufacturers going to catch up with this latest advance,
with models that take bga ball oblateness into account?

Regards

Jon Keeble
********
REALISE

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