[SI-LIST] Package characterisation
- From: "Eoin Mc Gibney" <emcgibney@xxxxxx>
- To: <si-list@xxxxxxxxxxxxx>
- Date: Thu, 8 Jun 2006 14:28:11 +0100
Hi Vijay,
For CAD packages, since you are dealing with a 3D structure then some 3D
field solver (HFSS, CST etc..) would be required to evaluate signal
integrity issues, optimise ball placement etc. This will allow you to do
parametric sweeps of the geometry of the package and material properties. A
package with 729 I/Os is very large and would require 1458 ports in a
simulation, so you may have to divide the package into critical areas and
analyse them individually in smaller more managable simulations. You could
also maybe look at quasi static solvers to obtain equivalent circuits for
circuit simulation. It depends on what you wish to characterise,what output
you would like (RLC, s-parameters..),the level of accuracy required, and
frequencies of operation etc.
From a lab measurement point of view probing 729 I/Os will be fairly time
consuming, probably require a probe station and some test fixture to mount
your package on, specific terminations internally in the package etc. Again
you could pick some critical nets and measure them using either a VNA or
TDR/T and benchmark your simulations which is more flexible than a huge load
of lab measurements.
Regards,
Eoin
=================================
Eoin Mc Gibney
Dept. of Electronic Engineering
Centre for Adaptive Wireless Systems
Cork Institute of Technology
Bishopstown
Cork
Ireland
www.aws.cit.ie
=================================
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