Hi Jenni, In short, no, it is not enough. Easier for me to prove by example. 1) In an effort to save money a senior engineer changed the power plane copper weight from 1 oz to 1/2 copper. What he forgot to consider was that there was a low voltage deca-amp distribution path that meandered its was around and across the plane. End result was that the device at the end of the path ended up with a lower voltage than it could operate with. So, boost the output of the supply you say? Well, when he tried that the first load on the rail had a higher voltage than it could operate with. Lesson learned? Beware of IR drop on low voltage (1.2V in this case) very high current paths. 2) An ASIC had problems with dropping bits of data under heavy load. The chip worked properly on many other boards except two new ones. Looking at the decoupling beneath the chip every thing looked fine. Unfortunately, no one had looked at what rails the caps were attached to. In the layout tool by assigning different colors to different rails it became painfully obvious that a large number of the caps beneath the device were attached to power rails that the chip could care less about. Hence, the dropping of bits of data occasionally. Someone had thought that they had a "better" decoupling scheme than the previous designer. Lesson learned? Don't just change something without a good reason and proper checking. 3) I've also fixed a number of designs where the designer deleted decoupling caps because "there wasn't room" for them. What they forgot to check was if they were needed for the chip to work. They were. Hope this helps. -Michael And all this science they don't understand Is just my job six days a week..... We will either find a way or make one -Hannibal In the middle of every difficulty lies opportunity -Al Einstein On Wed, Mar 24, 2010 at 8:33 AM, Jennifer Maharani < jennifer.maharani@xxxxxxxxx> wrote: > Hello all, > > In designing PDN (chip-pkg-board), many people do frequency domain > analysis to determine the impedance of the PDN. What is it for? As far > as power integrity is concerned, isn't it better and enough to run > transient simulation to see the PWR/GND bounce seen from the chip e.g. > I/O ? > > Many thanks, > Jenni > ------------------------------------------------------------------ > To unsubscribe from si-list: > si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field > > or to administer your membership from a web page, go to: > //www.freelists.org/webpage/si-list > > For help: > si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field > > > List technical documents are available at: > http://www.si-list.net > > List archives are viewable at: > //www.freelists.org/archives/si-list > > Old (prior to June 6, 2001) list archives are viewable at: > http://www.qsl.net/wb6tpu > > > -- Best Regards, Michael C. Greim ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu