Hi all,
We are hosting a free Free Webinar on "Coupled Electromagnetic & Thermal
Analysis of High-speed Printed Circuit Boards"
please join us, for an interesting presentation and Q&A round table. Bring
your questions. Details below:
Register
<http://r20.rs6.net/tn.jsp?e
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When evaluating printed circuit board (PCB) designs, engineers must balance
the
requirements of multiple physics disciplines - electrical, thermal and
mechanical
- to produce PCB designs that contribute to long service life and reduced
product
failure.
Join this webinar to examine how ANSYS multiphysics simulation allows
engineers
to analyze the overall reliability of a printed circuit board, simulating
individual
physical phenomena as well as the interaction between physics disciplines
to improve
overall product performance. Learn how power- and signal-integrity analysis
can
minimize crosstalk and evaluate the board's power integrity; how thermal
simulation
can evaluate board temperatures and ensure that the device operates within
an allowable
temperature range; and how thermal−stress simulation can guarantee
mechanical
reliability.
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Coupled Electromagnetic & Thermal Analysis
of High-speed Printed Circuit Boards
Thursday, May 7, 2015
2:00 PM EDT, 6:00 PM GMT
Duration: 60 minutes with live Q & A
Register
<http://r20.rs6.net/tn.jsp?e
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Best,
David Vye
Business Development Manager, ANSYS Inc.
Work: 781.743.0622
Mobile: 978.884.2971
Twitter: @EM_Sim_Biz <https://twitter.com/EM_Sim_Biz>
Receive my updates on upcoming events: Electronic Simulation Updates
<http://visitor.r20.constantcontact.com/manage/optin?v
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