I'm surprised at the tone of the responses to this posting (but perhaps I shouldn't be, unfortunately); I don't see anything untoward in it. I would like to provide some context (with some assumptions on my part) for the message lest other innocent postings meet with similar fates. I'll also (eventually) provide my answer to the question, as I understand it. There is a significant portion (majority?) of the industry which is extremely cost constrained. For instance, to them rotating a design 10 degrees is impractical, much less 22 or 45 degrees. Thus, they find other cost-effective yet effective means of solving problems (such as zig-zag routing), even though those don't appear efficient to others to whom cost is not an issue. There are new pressures being applied to this segment - designers are now not only requiring impedance control, but are also insisting on insertion loss control. This is a HUGE paradigm shift, very similar to what we encountered when traceable impedance control was first introduced. That was a very challenging evolution, and this will be also. As an example, PCB vendors are now being advised to smooth their copper, after years of purposely roughening it for best mechanical integrity. It should come as no surprise that this is not a trivial change, considering the effort that has gone into ensuring mechanically robust designs. Likewise, many other basic assumptions that we've been able to apply for years are now being drawn into question, and PCB vendors are looking for help to intelligently and cost-effectively explore options - "How much effect does rougher copper have on insertion loss?". I believe Terry is highlighting the fact that, while there are many tools available for impedance prediction, insertion loss modeling is much less accessible. I don't think it is inappropriate to ask if there are cost-effective, reliable tools available to predict insertion loss based on a proposed stackup. Unfortunately, I believe the answer to the question is that there are no reliable, cheap (~free) modelers available to predict insertion loss. And, the ones that are available require a great deal more knowledge about the stackup than impedance modeling does, and that information is not easily obtained. There are some of us working with a vendor to test their modeler against a variety of stackups and we'll present results at DesignCon. My personal goal is not so much to test a specific modeler but to judge how effective a modeler can be given information that can reasonably be gleaned prior to building with various materials, copper types, etc. In the absence of a modeling tool, or in addition to one, I believe empirical data is the best predictor of insertion loss. To do this, however, you have to build a stackup representing the final design, and it's not clear at this point how broadly you can extrapolate those results to other stackups. But, I know many material vendors and PCB shops are engaged in similar efforts. I think this is very similar to what we went through with impedance control - the shops which most quickly were able to predict and control that characteristic had an advantage. I think successful PCB vendors will need reliable modeling software and empirical data on insertion loss for their particular choices of materials, etc. - they will be able to find the most cost effective solution. Bottom line: I doubt a reliable modeling tool is going to be cheap, but is going to be necessary, and you'll want to compare any tool you do purchase against empirical data before you trust it. I hope this helps, Jeff Loyer -----Original Message----- From: si-list-bounce@xxxxxxxxxxxxx<mailto:si-list-bounce@xxxxxxxxxxxxx> [mailto:si-list-bounce@xxxxxxxxxxxxx]<mailto:[mailto:si-list-bounce@xxxxxxxxxxxxx]> On Behalf Of Terry Ho Sent: Monday, October 29, 2012 5:52 PM To: si-list@xxxxxxxxxxxxx<mailto:si-list@xxxxxxxxxxxxx> Subject: [SI-LIST] PCB Insertion loss prediction Hello experts, I'm from PCB house. Recently we have producted some insertion loss test boards(16L, SET2DIL coupon, IS415/IT150DA/I-Speed Mid/low loss material with RTF copper foil). We found that the multiply core and high resin PP will result a lower loss result. It's a trouble to MI engineer. I would like to know how to predict the loss base on stackup. Please help to suggest (papers, script, free software etc ). Thanks a lot! Best regards, Terry Ho ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx<mailto:si-list-request@xxxxxxxxxxxxx> with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx<mailto:si-list-request@xxxxxxxxxxxxx> with 'help' in the Subject field List forum is accessible at: http://tech.groups.yahoo.com/group/si-list List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List forum is accessible at: http://tech.groups.yahoo.com/group/si-list List archives are viewable at: //www.freelists.org/archives/si-list Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu