[SI-LIST] New low inductance second level Interconnection (module to card) (SpringLand Grid Array)

  • From: "Jean Audet" <jaudet@xxxxxxxxxx>
  • To: si_list <si-list@xxxxxxxxxxxxx>
  • Date: Mon, 17 Feb 2003 13:55:18 -0500


The SLGA (Spring Land Grid Array)  is basically a lead free dual legs for
every single IO interconnect, The dual legs reduce the inductance of the
interconnections versus a single leg and  allow very good signal integrity
for HS net.

For people who may be interrested, to get a plugeable solution (LGA) with
low pin inductance values and high reliability solution,  I can send
picture  and documentation about it to interrested people.


A technical paper will be presented at the ECTC 2003  conference...."
Electrical modeling and Characterization of package solutions utilizing
lead-free second level interconnects "

I trying to include a jpg...but I do not think people will get it...



(Embedded image moved to file: pic03123.pcx)


Jean Audet
Electrical Analysis
InterConnect Products IMD
IBM Burlington
Tel: 802-769-0835, tie line: 446-0835
Tel: 450-534-6317, tie line: 552-6317
E-mail: jaudet@xxxxxxxxxx



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  • » [SI-LIST] New low inductance second level Interconnection (module to card) (SpringLand Grid Array)