[SI-LIST] Measuring an IC PDN
- From: "Moreira, Jose-Antonio" <jose.moreira@xxxxxxxxxx>
- To: "si-list@xxxxxxxxxxxxx" <si-list@xxxxxxxxxxxxx>
- Date: Thu, 26 Jan 2012 18:39:15 +0000
Hi,
I have a small discussion topic.
Assuming I have:
-> model and measurements of a package PDN (flip-chip package that includes
some capacitors).
-> no model of the IC die PDN and no way to do measurements on a bare die.
Objective would be to get an idea on the IC die PDN and check if I have some
resonances happening between the package and the die .
The only option I see is to do a S11 measurement of the one VDD/GND pin pair
(e.g. with a coaxial probe) at the package setting on the VNA measurement
signal a DC offset equivalent to the VDD that the IC expects and then somehow
de-embed the package PDN.
Given all the problems of using S11 for a PDN measurement I assume the results
will be bad but would I be able to get an idea of any resonances between the
package power plane/capacitors.
Any other options? I would also appreciate any references to published previous
work on this specific topic.
Jose------------------------------------------------------------------
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