[SI-LIST] Re: MLF packages
- From: "Chandrakanth" <Chandrakanth@xxxxxxxxxxxxx>
- To: <gschneider@xxxxxxxxx>, <vivekchandra59@xxxxxxxxx>, <si-list@xxxxxxxxxxxxx>
- Date: Fri, 9 Dec 2005 08:21:41 +0530
Sorry sir,
I am unable to get any attachments from the SI-List.Even the MLF.dxf
attached to this mail as specified in it.Why is it so?
Reagrds,
Chandra Kanth
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx
[mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of Gary Schneider
Sent: Thursday, December 08, 2005 20:06
To: vivekchandra59@xxxxxxxxx; si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] Re: MLF packages
Vivek,
I am attaching a dxf of the footprint we use for our 28 pin mlf
package.
This has worked quite well for us. Notice 4 separate paste mask and
solder mask areas on the die pad. The pads are also oversized to extend
outside the package which will make it much easier for visual
inspection. Hope this helps.
Gary
-----Original Message-----
From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
On Behalf Of Vivek Chandra
Sent: Thursday, December 08, 2005 7:07 AM
To: si-list@xxxxxxxxxxxxx
Subject: [SI-LIST] MLF packages
Hello ,
I'm facing a lot of problem debugging an MLF-32 or ML-28 package for
high
speed board design. Most of the time when i finish my debugging i end up
with a conclusion that the soldering of the package pins are not proper
and
hence the problem. Does anyone out there know if there is any confirmed
and
guaranteed method of soldering these type of packages? Also to ease out
my
debugging time would there be any methods for design for testability in
this
type of packages, because sometimes there is a rare possibility that the
IC
pin might not be getting any lead or contact with the pad.
Thanks
Vivek Chandra
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-- Binary/unsupported file stripped by Ecartis --
-- Type: application/octet-stream
-- File: mlf.dxf
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