Around 1996-1997, a presentation have been done by University of Arizona about the '' Influence of a Floating Plane on Effective Ground Plane in Thin Film Multilayer and Lead Frame package'' Into this presentation, the effective inductance simulation for a multilayer package having floating plane above is worst than whitout floating plane. Basically the structure (x-section) is the following Floating plane Signal Ground plane The Leff graph shows a Leff lower for structure whitout floating plane. I'm little surprise about the simulation results. Is someone has more data about that... or maybe M. Prince may reply if he is in the distribution list Also I have only a hard copy of this presentation, Is someone else has a soft copy ? Jean Audet Electrical Analysis World Wide Packaging & Test IBM Burlington Tel: 802-769-0835, tie line: 446-0835 Tel: 450-534-6317, tie line: 552-6317 E-mail: jaudet@xxxxxxxxxx ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu