[SI-LIST] Re: Information regarding Stackup Design.
- From: "DAVID CUTHBERT" <telegrapher9@xxxxxxxxx>
- To: "Curt McNamara" <curt.mcnamara@xxxxxxxxxxx>
- Date: Wed, 16 Jul 2008 07:35:44 -0600
Curt,
the skin depth at 20 MHz is equal to the thickness of 1/2 oz copper so yes
there will be coupling thru the material.
Dave Cuthbert
On Tue, Jul 15, 2008 at 5:03 PM, Curt McNamara <curt.mcnamara@xxxxxxxxxxx>
wrote:
> There have been some reports that at 1/2 oz. the return current from =
> traces on opposite sides of a plane can interfere. I suppose this =
> implies that for a signal layer you are nearing skin depth, but have no =
> data on this.
>
> Curt
>
>
> Curt McNamara, P.E.=A0// principal electrical engineer=20
> Logic Product Development
> 411 Washington Ave. N. Suite 400
> Minneapolis, MN 55401
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> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] =
> On Behalf Of Ravindra Gali
> Sent: Thursday, July 10, 2008 12:02 PM
> To: si-list@xxxxxxxxxxxxx
> Subject: [SI-LIST] Information regarding Stackup Design.
>
> Gurus,
>
>
> I would like to get your valuable feedback on the following:
>
> 1) Advantages/Disadvantages about using 1/2 Oz Cu for signal routing on =
> the inner layers. One issue that I can think of is the potential =
> increase in DC IR drop if I plan to use the signal layers for carving =
> out a power island. Are there any other issues that I need to be aware =
> of before going down this path?
>
>
>
> 2) I have seen substrate vendors specifying two different Er/Df values =
> for two different frequencies (1GHz, 10GHz). What is the current =
> industry practice about which Er value to use when coming up with the =
> trace geometries to meet impedance requirements? I was planning to use =
> the Er value at high frequency since the edge rates for my scenario are =
> fast. Any suggestions from the group are welcome.
>
>
>
> Thanks,
>
> Ravi.
>
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