[SI-LIST] Re: IC Packaging positions at Apple
- From: Santos Fernández, Jesús <jsantosfernandez@xxxxxxxx>
- To: Sandy Perlman <sandyperlman@xxxxxxxxx>, SI LIST <si-list@xxxxxxxxxxxxx>
- Date: Fri, 13 May 2011 09:49:58 +0200
From the details of these openings (not only this one), it is clear who
dominates the situation (and abuses)
They describe what they need, but don't even care to provide the location.
I use the same approch when I specify a machine to my Purchase Department.
An absolute disregard for the professional engineers.
I, as an engineer, don't feel well when I read them.
J Santos
-----Mensaje original-----
De: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx] En
nombre de Sandy Perlman
Enviado el: jueves, 12 de mayo de 2011 23:21
Para: SI LIST
Asunto: [SI-LIST] Re: IC Packaging positions at Apple
The location is Cupertino CA
On May 12, 2011, at 1:18 PM, steve weir wrote:
> Sandy, you should probably state the location for these positions. Most will
> assume Cupertino, but it's good to be clear.
>
> Steve.
> On 5/12/2011 12:44 PM, Sandy Perlman wrote:
>> I am staffing a group at Apple that develops SOCs that will be used in Apple
>> mobile devices.
>>
>> IC Packaging Assembly Engineer
>> Responsible for all the technical aspects of assembly engineering for high
>> end IC packaging of mobile devices. Working with SoC design, system group
>> and OSATs to define and execute the state-of-art assembly technology roadmap
>> including PoP, SiP, CSP, wirebond and flip chip BGA. Must have hands-on
>> experience with assembly process including bumping, die attach, underfill,
>> molding, BGA, wirebonding. In-depth knowledge of packaging material set
>> including polymer, metallurgy and packaging substrate . Working skills of
>> failure analysis, in-line monitor tools and assembly equipments, package
>> reliability and board level reliability. Familiar with SPC, DOE and other
>> statistics tools.
>>
>> Minimum Master degree in mechanical engineering or materials science +>5
>> years experience in IC packaging or related industry.
>>
>> IC Packaging Substrate Sr. Technologist Owner of IC packaging
>> substrate roadmap and design rules. Working with substrate vendors and
>> internal system, packaging design and SI team to identify the proper
>> substrate technology and design rules to meet electrical performance,
>> manufacturability and cost-effectiveness. Review the package layout and
>> provide feedback in design optimization and manufacturability. Must have
>> hands-on experience with the IC packaging substrate fabrication. Working
>> knowledge of polymer science and metallurgy, as well as electrical
>> implication.
>>
>> Minimum Master degree in mechanical engineering, material science or
>> chemical engineering +> 5 years experience in IC packaging or related
>> industry.
>>
>> IC Packaging Mechanical Engineer
>> Responsible for mechanical analysis, material characterization/testing of IC
>> packaging of mobile devices. Perform analytical and/or finite element
>> analysis for structural and material optimization of packages, component and
>> board level reliability including thermal cycling, moisture attack,
>> delamination, solder joint fatigue, and drop/shock. Drive the reliability
>> methodology development. Working knowledge of FCBGA, PoP, CSP and wirebond
>> BGA type of packages.
>>
>> Ph.D. degree in mechanical engineering or material science +> 5 years
>> experience in semiconductor or mobile industry.
>>
>> Please send me a resume if you are interested.
>>
>> Sandy Perlman
>> Sr Recruiter
>> Apple Inc.
>> sandyperlman@xxxxxxxxx
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>
>
> --
> Steve Weir
> IPBLOX, LLC
> 150 N. Center St. #211
> Reno, NV 89501
> www.ipblox.com
>
> (775) 299-4236 Business
> (866) 675-4630 Toll-free
> (707) 780-1951 Fax
>
>
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