[SI-LIST] Re: Hyperlynx vs. Signal Explorer

  • From: Scott McMorrow <scott@xxxxxxxxxxxxx>
  • To: james.f.peterson@xxxxxxxxxxxxx
  • Date: Thu, 11 Jan 2007 15:19:04 -0500

Jim
The reality is that with 100 ps of margin you may already be SOL.  Most 
board level signal integrity tools do not take package crosstalk, SSI, 
SSO and power bounce effects into consideration ... and the 
manufacturers often do not derate their timing to account for this either. 

I've worked with quite a few cases where reverse crosstalk was already 
saturated within the package.  It did literally did not matter what you 
did to trace spacing externally, if you kept the same aggressors as in 
the package, you couldn't produce any more timing jitter. In fact, since 
the reverse crosstalk in the package reflected off the drivers during 
the transition edges, it was an even larger impediment than any reverse 
crosstalk on the board, which was not time correlated with the edges.

Oh, and don't get me started on I/O power system resonance phenomenon at 
exceedingly high single-ended bus speeds.  No amount of conventional 
board level SI simulation will even acknowledge that a problem exists.  
But you should watch how we can make parts sing and dance in the lab.


best regards,

Scott


Scott McMorrow
Teraspeed Consulting Group LLC
121 North River Drive
Narragansett, RI 02882
(401) 284-1827 Business
(401) 284-1840 Fax

http://www.teraspeed.com

Teraspeed® is the registered service mark of
Teraspeed Consulting Group LLC



Peterson, James F (EHCOE) wrote:
> Agathon -
>
> You and Chris are both making some good points - and seem to speak from
> experience.=20
>
> but.......
>
> If we only have 100s of pico-seconds of timing margin in our circuit, or
> even less, how can we choose to not perform a post-route simulation? It
> seems like we're gambling with our company's profits if we don't do
> it...
>
> take care,
> Jim Peterson
> Honeywell
>
> -----Original Message-----
> From: si-list-bounce@xxxxxxxxxxxxx [mailto:si-list-bounce@xxxxxxxxxxxxx]
> On Behalf Of agathon
> Sent: Thursday, January 11, 2007 2:02 PM
> To: si-list
> Subject: [SI-LIST] Re: Hyperlynx vs. Signal Explorer
>
> Chris,
> A very instructive reply from you.  Of what, I'm not sure.
>
>
> You are telling me you have no parrallism rules nor termination scheme
> nor
>   
>> topology constrain on these buses and have a free for all and use the=20
>> post route analysis to tell yourself whether it work or not ? Your=20
>> precious DDR2 nibbles and strobes are not grouped routed switched=20
>> turned in the same way and are randomly free running ?
>>
>>     
>
> No, you're saying that, "my precious".  Free run.  Good deal.  Sounds
> good to me.
>
> Pwr integrity, that's another interesting subject. What exactly are you
>   
>> suppose to do in your post route analysis to verify those coupling and
>>     
>
>   
>> impedance profile issue you are talking about ?
>>
>>     
>
> I'm not a fan of "post-route sim"; it seems to be a marketing tool to
> sell, uh, tools.  I hope you're not using it.  If you are, call me and I
> can
> dissuade you.   It won't help with PI, except to detect where return
> paths
> on the board are forced inductive by layout and enough current induces
> noise on a return plane.  But then you need a 2.5-3D model or set.
> Correct; no insight is gained into Z profile of pcb itself by signal
> sims.
>
> "Pkg design", what exactly are you packaging designing with your post
> route
>   
>> PCB?  Pick up every single net in your PCB memory bus and extract your
>>     
>
>   
>> package also and simulate the entire bus switching at the same time to
>>     
>
>   
>> verified it works ? I know many ways to do that without doing the
>>     
> above.
>   
>> BTW, are you doing the above or you are just talking about it. Talk is
>>     
>
>   
>> cheap, do you practice what you preach ?
>>
>>     
>
> Ah, it's "my kung-fu better than your king-fu, eh"?  Vedy good.  Yes,
> they call me "Preacher".
> I remember similar retorts from you in the past.  Did you cut & paste
> them
> here from old email, or did you actually read mine carefully?   Sorry,
> if
> you want the answer you can send me a proposal.  My talk come very
> expensive.  Many dollars.  On the other hand, I find it very cheap and
> easy to fling challenges.  Hey, look Ma, I'm gettin' good at this, too!
>
> A brief answer:  You need accurate signal switching current profile (I,
> time) to establish current demand on die/pkg for Vio.  Sims aren't
> necessary; you can calculate it and use macromodel current sources, with
> accurate time profiles per ball, and a voltage-supply model, to stim the
> pkg/die and behold the vio noise.   For Vcore, obtaining actual bare die
> current profiles is the issue.  Also, a good lumped or Sparam pkg model
> can be converted to a Z profile in different tools, to correlate with
> estimates (among those things that I can provide you after I receive
> your proposal).
> If you violate the noise limits, then optimize & iterate.  Got it?
>
> What exactly are you supposed to do with coupling and impedance profile
>   
>> issue on the DIMM, do you even get a PCB model from your vendor ? Once
>>     
>
>   
>> again, talk is cheap, tell me what you are doing yourself, not what=20
>> you heard from a conference or read from a paper.
>>
>>     
>
> This I say, no charge, just for you:  Send me a proposal.  I send you a
> quote (not cheap, you know).  Then I tell you all about Z profile of
> DIMM, incl. how-to, dependence on # of rail loads and dimm connector and
> optimization methods.  Then you can tell me how all your knowledge, such
> as it is, was immaculately conceived by you in a cave somewhere, with no
> conferences or readings.  No, I'm serious.  I'd like to know.  Until
> then, "I'll never telllll".  Others interested can ask offline & I'll
> answer ...for free.
>
> "1+GHz serial links also need loss & ISI estimates for certain cases."
>   
>> Ok, if you have already constrain your length, via and parallelism=20
>> rules pre-route, what is left to verify if the rules are met and there
>>     
>
>   
>> is no DRC ? Turn the table around, if you don't constrain the=20
>> length,via and parallelism before hand, are you using your post-route=20
>> simulation to assure it works ?
>>
>>     
>
> Yes, loss can be well estimated with calculation, without sims.  But,
> ISI is pattern & xtalk dependent.  Hence, simulate.  Can use PDA
> methods, too.
> Sims are used to see how much you can push the envelope, since in
> certain cases you have to.  Hello?
>
> Now, off you go and don't forget anything.  :-)
>
>
> On 1/10/07, Chris Cheng <Chris.Cheng@xxxxxxxxxxxx> wrote:
>   
>> No, I am serious. I want to know.
>>
>> You are telling me you have no parrallism rules nor termination scheme
>>     
>
>   
>> =3D nor topology constrain on these buses and have a free for all and=20
>> use =3D the post route analysis to tell yourself whether it work or =
>>     
> not=20
>   
>> ? Your =3D precious DDR2 nibbles and strobes are not grouped routed=20
>> switched turned =3D in the same way and are randomly free running ?
>>
>> Pwr integrity, that's another interesting subject. What exactly are=20
>> you =3D suppose to do in your post route analysis to verify those=20
>> coupling and =3D impedance profile issue you are talking about ? "Pkg=20
>> design", what =3D exactly are you packaging designing with your post=20
>> route PCB ? Pick up =3D every single net in your PCB memory bus and=20
>> extract your package also =3D and simulate the entire bus switching at =
>>     
>
>   
>> the same time to verified it =3D works ? I know many ways to do that=20
>> without doing the above. BTW, are =3D you doing the above or you are=20
>> just talking about it. Talk is cheap, do =3D you practice what you
>>     
> preach ?
>   
>> What exactly are you supposed to do with coupling and impedance=20
>> profile =3D issue on the DIMM, do you even get a PCB model from your=20
>> vendor ? Once =3D again, talk is cheap, tell me what you are doing=20
>> yourself, not what you =3D heard from a conference or read from a =
>>     
> paper.
>   
>> "1+GHz serial links also need loss & ISI estimates for certain=20
>> cases."=3D20 Ok, if you have already constrain your length, via and=20
>> parallelism rules =3D pre-route, what is left to verify if the rules =
>>     
> are
>
>   
>> met and there is no =3D DRC ? Turn the table around, if you don't=20
>> constrain the length,via and =3D parallelism before hand, are you =
>>     
> using=20
>   
>> your post-route simulation to =3D assure it works ?
>>
>> -----Original Message-----
>> From: si-list-bounce@xxxxxxxxxxxxx
>> [mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of agathon
>> Sent: Wednesday, January 10, 2007 5:54 PM
>> To: si-list
>> Subject: [SI-LIST] Re: Hyperlynx vs. Signal Explorer
>>
>>
>> Chris,
>> heh heh,  yer funny...
>>
>> Good point.  I think you know the answer:
>> Basic timing & such is assumed ok.  What's sim'd is crosstalk effect =
>>     
> =3D
>
>   
>> where you're pushing things, termination placement, excessive vias=20
>> (1st one is =3D the worst, though), proper termination scheme vs.=20
>> topology (such as the =3D various
>> ddr2 options... not necessarily a simple choice if not a dimm), pwr
>> integrity (PI) for dimm stuff - esp. if there's pkg design.    =3D
>> Concerning
>> the PI, there really are coupling and impedance profile issues at =3D
>> ddr2-667
>> on a dimm.  1+GHz serial links also need loss & ISI estimates for =3D=20
>> certain cases.
>>
>>
>> On 1/10/07, Chris Cheng <Chris.Cheng@xxxxxxxxxxxx> wrote:
>>     
>>> Sorry for being simple minded.
>>> In this day of source synchronous and serial buses.=3D3D20
>>> What exactly is needed to simulate on your PCB once the match length
>>>       
> =3D
>   
>> and =3D3D
>>     
>>> parallelism rules are constrained in your router and no DCR is
>>>       
> shown.
>   
>>> -----Original Message-----
>>> From: si-list-bounce@xxxxxxxxxxxxx
>>> [mailto:si-list-bounce@xxxxxxxxxxxxx]On Behalf Of Beal, Weston
>>> Sent: Wednesday, January 10, 2007 2:31 PM
>>> To: si-list
>>> Subject: [SI-LIST] Re: Hyperlynx vs. Signal Explorer
>>>
>>>
>>>
>>> This discussion comes up at least once a year and the answer is
>>>       
> still
>   
>>> the same. The best description I've seen was a couple of years ago.
>>>       
> =3D
>   
>> All
>>     
>>> EDA tools suck if you use them long enough. The deeper you get into
>>>       
> =3D
>   
>> it,
>>     
>>> the more bugs you find. Don't go too deep into it and you'll be
>>>       
> happy =3D
>   
>> in
>>     
>>> your ignorance :)X=3D3D3D20
>>>
>>> Now, the useful answer is that you need to look at features beyond
>>> functions. Every SI simulator simulates digital nets to some useful
>>> accuracy. Does it interface well to your PCB layout tool? Do you
>>>       
> need =3D
>   
>> it
>>     
>>> to? Does it output results in the way you want to use it? Does it
>>> support models of the effects that you are concerned with? Does it =
>>>       
> =3D
>   
>> have
>>     
>>> the post-processing (waveform measurement) that you need? Is the
>>>       
> cost
>   
>>> within your budget? Can you, and do you want to, automate the tool
>>>       
> for
>   
>>> your work flow?
>>>
>>> So before you go looking too far for the right tool, you should
>>>       
> figure
>   
>>> out what is the job you need to do. If you just want to simulate a
>>>       
> net
>   
>>> once in a while to show pretty waveforms to your manager then get
>>>       
> the
>   
>>> cheapest tool you can find that makes pretty waveforms and you both
>>>       
> =3D
>   
>> will
>>     
>>> be happy for the immediate future. If you want a fully extensible,
>>> highly accurate, feature rich SI tool then get ready to spend some
>>>       
> big
>   
>>> money and time to get it set up in your environment. Thereafter you
>>>       
> =3D
>   
>> will
>>     
>>> find long-term joy. Most users want something in between. That's why
>>> there are so many SI tools on the market. Decide what is important
>>>       
> to
>   
>>> you and then the choice of tool will be fairly obvious.
>>>
>>> Regards,
>>> Weston
>>>
>>>
>>> -----Original Message-----
>>> From: si-list-bounce@xxxxxxxxxxxxx =3D
>>>       
>> [mailto:si-list-bounce@xxxxxxxxxxxxx]
>>     
>>> On Behalf Of agathon
>>> Sent: Wednesday, January 10, 2007 12:41 PM
>>> To: si-list
>>> Subject: [SI-LIST] Re: Hyperlynx vs Signal Explorer
>>>
>>> I recently received a comment about just this from an acquaintance:
>>> ----
>>> "Short answer:  anyone trying to make full use of Cadence pcb si
>>>       
> tools
>   
>>> for
>>> interconnect sim and who, nevertheless, recommends it could make
>>>       
> good
>   
>>> use of
>>> counseling of some kind... or the receivers of that info could make
>>>       
> =3D
>   
>> good
>>     
>>> use
>>> of a polygraph test on the one recommending.   All this based on 1st
>>> hand
>>> experience over time."
>>>
>>> ----
>>> No info on Hyperlynx.
>>>
>>>
>>>
>>> On 1/9/07, cdomeny <craig.domeny@xxxxxxxx> wrote:
>>>       
>>>> We are considering adding a base-model (<GHz) SI tool to our PCB
>>>>         
>>> design
>>>       
>>>> flow and have looked at Mentor Hyperlynx EXT and Cadence Orcad Sig
>>>> Explorer. In research, it seems the Cadence tool does not actually
>>>> perform "physical extraction", but is able to do a post-layout
>>>>         
>>> analysis
>>>       
>>>> somehow. Can anyone help?
>>>>
>>>> Hyperlynx "seems" more mature, but cost ~2X. However, we are =3D
>>>>         
>> concerned
>>     
>>>> also about post-layout, and if Hyperlynx actually extracts the =3D
>>>>         
>> layout,
>>     
>>>> it seems like a more robust method.
>>>>
>>>> Any help, insight, or guidance is appreciated.
>>>>
>>>> Thanks, - Craig
>>>>
>>>> ------------------------------------------------------------------
>>>>
>>>>
>>>>         
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