Hi I had a couple of questions of interpreting the results from Hyperlynx if any of the experts out their may know the answer or point me to the answer. 1. Does Hyperlynx simulate the ESD protection diodes through the ground/vcc clamp parameter in the IBIS model or is it omitted to show real levels in the trace. I ask this, because if they do then the levels of overshoot/undershoot would likely be higher and other ICs could be buffering other parts by clamping the waveform before it exceeds their min/max specification. 2. Using the oscilloscope in Hyperlynx they give the current waveform in the CSV output file. Is this the current measured in the trace connecting to the driver, or is it the current that is actually entering the protection diodes/parasitic capacitance of the part? Sorry, if this questions seem trivial. I want to make sure that when I see overshoot/undershoot that I correctly interpret the levels to make recommendations. Any other information on interpreting/using Hyperlynx for SI application would be greatly appreciated. Erin McPhalen ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List FAQ wiki page is located at: http://si-list.org/wiki/wiki.pl?Si-List_FAQ List technical documents are available at: http://www.si-list.org List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu