Graham, the answer is probably a lot more than you would like. The bond wire portion of the inductance loop will depend on factors such as: proximity to other power bond wires of each polarity, bond wire length and the shape of the arc. A starting number would be around 10nH for one pair by the time you get to the PCB. If you are pumping out 100-150ps edges, and have good hf bypass on die, then one power / gnd wire pair for every four signals should get you in the ballpark. I caution you to make sure that you make it feasible for your end customer to package a realizable PDN on their PCB. The cheap package that you are going into pretty much precludes on-substrate caps, so you are forcing the bypass problem down to your customer where it is even harder to solve. If you put too much inductance between your customer's plane attachment and your die the game is over. Good luck. Steve. Graham Kus wrote: > Hi everyone, > So I have a question. When designing a power supply distribution system > (PDS) for an FBGA bond-wire ASIC package, how many bond-wires are "enough?" > I understand that 25um(1 mil) diameter bond-wires can accommodate almost 1 > Amp at DC, but I suspect this is completely off base when driving a bus with > one of these. > > The background on my situation involves DDR-2 drivers, and having enough > bond-wires to prevent SSO. This IC package is an FBGA, 4 layer substrate > board. The IP vendor supplied pin-based RLC charts for a lead-frame type > package (although I have yet to see DDR-2 in a TSSOP). These translate well > to signal routes, but the physics the PDS are different than lead-frame pin > structures. Also this vendor's numbers for power are based literally on a > "rule of thumb chart," which to me is code for "open your SI tool and double > check." We wrestled them into giving us Spice versions of the buffer under > NDA, so presumably we can simulate this ourselves. Anyhow if you guys have > advice, I could use it. > > Thanks in advance, > > -Graham > > > [gmail search terms: bondwire bond-wire wirebond wire-bond] > > > ------------------------------------------------------------------ > To unsubscribe from si-list: > si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field > > or to administer your membership from a web page, go to: > //www.freelists.org/webpage/si-list > > For help: > si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field > > > List technical documents are available at: > http://www.si-list.net > > List archives are viewable at: > //www.freelists.org/archives/si-list > or at our remote archives: > http://groups.yahoo.com/group/si-list/messages > Old (prior to June 6, 2001) list archives are viewable at: > http://www.qsl.net/wb6tpu > > > > > -- Steve Weir Teraspeed Consulting Group LLC 121 North River Drive Narragansett, RI 02882 California office (408) 884-3985 Business (707) 780-1951 Fax Main office (401) 284-1827 Business (401) 284-1840 Fax Oregon office (503) 430-1065 Business (503) 430-1285 Fax http://www.teraspeed.com This e-mail contains proprietary and confidential intellectual property of Teraspeed Consulting Group LLC ------------------------------------------------------------------------------------------------------ Teraspeed(R) is the registered service mark of Teraspeed Consulting Group LLC ------------------------------------------------------------------ To unsubscribe from si-list: si-list-request@xxxxxxxxxxxxx with 'unsubscribe' in the Subject field or to administer your membership from a web page, go to: //www.freelists.org/webpage/si-list For help: si-list-request@xxxxxxxxxxxxx with 'help' in the Subject field List technical documents are available at: http://www.si-list.net List archives are viewable at: //www.freelists.org/archives/si-list or at our remote archives: http://groups.yahoo.com/group/si-list/messages Old (prior to June 6, 2001) list archives are viewable at: http://www.qsl.net/wb6tpu